XC4VLX200-11FFG1513C

Üretici firma: Xilinx
Mantık Hücreleri: 178,176?(~200K system gates)
Mantık Dilimleri: 22,272
Gömülü RAM (eRAM): 6,193 Kb (~336 × 18Kb Block RAM)
Paket: FFG1513 (Flip?Chip BGA)
Çalışma Sıcaklığı: Ticari (0°C ila +85°C)

BIZE MESAJ GÖNDERIN

    Teknik Özellikler

    MODEL P/N SERİLER LABORATUVAR/CLB SAYISI HIZ DERECESİ MANTIK ELEMANI / HÜCRE SAYISI TOPLAM RAM BİTLERİ G/Ç SAYISI VOLTAJ - BESLEME MONTAJ TİPİ ÇALIŞMA SICAKLIĞI PAKET / KASA TEDARIKÇI CIHAZ PAKETI
    XC4VLX200-11FFG1513C Virtex-4 LX 22.272,00 -11,00 200448 6193152 960 1,14 V ~ 1,26 V Yüzey Montajı 0 °C ~ +85 °C (Ticari) 1513-BBGA (FCBGA) 1513-FCBGA

    XC4VLX200-11FFG1513C: The Performance Pinnacle of High-Density Logic Integration

    Bu XC4VLX200-11FFG1513C is the highest-specification, high-density FPGA in the Xilinx Virtex®-4 LX family. Built on the 90nm ASMBL™ (Gelişmiş Silikon Modüler Blok) architecture, this device is engineered for architects who require the absolute maximum logic capacity paired with the superior -11 hız derecesi. It is the industry-standard choice for complex, logic-heavy applications where timing closure and single-chip integration are critical.

    Featuring a staggering 200.448 Mantık Hücresi and the fastest commercial speed grade, the LX200-11 is designed to push the boundaries of real-time data processing and large-scale system emulation.

    Key Engineering Advantages

    • Fastest Timing Closure (-11 Speed Grade): The -11 speed grade is essential for high-performance designs, providing a significant frequency boost over the standard -10 models. This extra headroom is vital for stabilizing 300MHz+ internal logic fabrics and high-speed memory interfaces.

    • Büyük Mantık Konsolidasyonu: With over 200k logic cells, this FPGA allows for the integration of entire multi-processor systems, complex encryption engines, and massive state machines into a single die, eliminating the latency and complexity of multi-chip partitioning.

    • Unrivaled I/O Capacity: Evin içinde FFG1513 package, the device provides 960 User I/Os. This allows for massive parallel throughput, easily supporting multiple wide-bus interfaces like DDR2/QDR-II and high-speed backplane protocols.

    • High-Performance DSP & Memory: Includes 6.048 Kb Blok RAM ve 96 XtremeDSP™ slices. The combination of dense memory and dedicated arithmetic hardware makes it a powerhouse for real-time signal processing and 4K video algorithms.

    • RoHS Compliant Flip-Chip Packaging: Bu FFG1513 package is optimized for both environmental compliance and thermal integrity. Its design ensures low-inductance power delivery and superior heat dissipation, even at high switching frequencies.


    Teknik Özellikler Matrisi

    Özellik Şartname
    Mantık Hücreleri 200,448
    CLB Dizisi 22,512
    Toplam Blok RAM 6,048 Kb
    DSP48 Dilimleri 96
    Maksimum Kullanıcı G/Ç 960
    Hız Sınıfı -11 (Yüksek Performans)
    Sıcaklık Sınıfı Ticari (0°C ila +85°C)
    Paket FFG1513 (Lead-Free / 1.0mm Pitch)

    Why Specify the LX200-11C?

    1. Solving the Routing Congestion Challenge

    In many high-density designs, routing congestion can kill timing. The Virtex-4 ASMBL architecture in the LX200 ensures a highly uniform distribution of logic, memory, and I/O. Combined with the -11 hız derecesi, this allows for much easier timing closure on designs that utilize 85% or more of the available logic resources.

    2. Ölçekte Sinyal Bütünlüğü

    Driving nearly 1,000 I/Os simultaneously requires a robust power distribution network. The FFG1513 package is specifically designed with an extensive array of VCC and GND pins to suppress Eşzamanlı Anahtarlama Gürültüsü (SSN), ensuring clean signal eyes for high-speed differential and single-ended signaling.

    3. Uzun Ömürlü Kararlılık

    The LX200-11C is a proven, mature platform. For mission-critical commercial systems—such as high-end medical scanners or broadcasting switchers—the stability of the Virtex-4 toolchain and the known reliability of the 90nm process provide a low-risk path to production.


    Hedef Uygulamalar

    • ASIC/SoC Prototyping: Large-scale logic verification and pre-silicon emulation.

    • Professional Video Gear: Real-time 8K/4K image reconstruction and conversion.

    • Telekomünikasyon: High-bandwidth switching fabrics and protocol acceleration.

    • Advanced Instrumentation: High-speed data acquisition and real-time analysis for scientific research.