| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX200-11FFG1513C | Virtex-4 LX | 22.272,00 | -11,00 | 200448 | 6193152 | 960 | 1.14V ~ 1.26V | 표면 실장 | 0°C ~ +85°C(상업용) | 1513-BBGA(FCBGA) | 1513-FCBGA |
XC4VLX200-11FFG1513C: The Performance Pinnacle of High-Density Logic Integration
그리고 XC4VLX200-11FFG1513C is the highest-specification, high-density FPGA in the Xilinx Virtex®-4 LX family. Built on the 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device is engineered for architects who require the absolute maximum logic capacity paired with the superior -11 속도 등급. It is the industry-standard choice for complex, logic-heavy applications where timing closure and single-chip integration are critical.
Featuring a staggering 200,448 로직 셀 and the fastest commercial speed grade, the LX200-11 is designed to push the boundaries of real-time data processing and large-scale system emulation.
Key Engineering Advantages
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Fastest Timing Closure (-11 Speed Grade): The -11 speed grade is essential for high-performance designs, providing a significant frequency boost over the standard -10 models. This extra headroom is vital for stabilizing 300MHz+ internal logic fabrics and high-speed memory interfaces.
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Massive Logic Consolidation: With over 200k logic cells, this FPGA allows for the integration of entire multi-processor systems, complex encryption engines, and massive state machines into a single die, eliminating the latency and complexity of multi-chip partitioning.
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Unrivaled I/O Capacity: 에 보관되어 있습니다. FFG1513 package, the device provides 960개의 사용자 I/O. This allows for massive parallel throughput, easily supporting multiple wide-bus interfaces like DDR2/QDR-II and high-speed backplane protocols.
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High-Performance DSP & Memory: 포함 사항 6,048KB의 블록 RAM 그리고 96개의 XtremeDSP™ 슬라이스. The combination of dense memory and dedicated arithmetic hardware makes it a powerhouse for real-time signal processing and 4K video algorithms.
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RoHS Compliant Flip-Chip Packaging: 그리고 FFG1513 package is optimized for both environmental compliance and thermal integrity. Its design ensures low-inductance power delivery and superior heat dissipation, even at high switching frequencies.
기술 사양 매트릭스
| 기능 | 사양 |
| 논리 셀 | 200,448 |
| CLB 어레이 | 22,512 |
| 총 블록 RAM | 6,048 Kb |
| DSP48 슬라이스 | 96 |
| 최대 사용자 I/O | 960 |
| 속도 등급 | -11(고성능) |
| 온도 등급 | 상업용(0°C ~ +85°C) |
| 패키지 | FFG1513 (Lead-Free / 1.0mm Pitch) |
Why Specify the LX200-11C?
1. Solving the Routing Congestion Challenge
In many high-density designs, routing congestion can kill timing. The Virtex-4 ASMBL architecture in the LX200 ensures a highly uniform distribution of logic, memory, and I/O. Combined with the -11 속도 등급, this allows for much easier timing closure on designs that utilize 85% or more of the available logic resources.
2. 규모에 따른 신호 무결성
Driving nearly 1,000 I/Os simultaneously requires a robust power distribution network. The FFG1513 package is specifically designed with an extensive array of VCC and GND pins to suppress 동시 스위칭 노이즈(SSN), ensuring clean signal eyes for high-speed differential and single-ended signaling.
3. 긴 수명 주기 안정성
The LX200-11C is a proven, mature platform. For mission-critical commercial systems—such as high-end medical scanners or broadcasting switchers—the stability of the Virtex-4 toolchain and the known reliability of the 90nm process provide a low-risk path to production.
대상 애플리케이션
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ASIC/SoC 시제품 제작: Large-scale logic verification and pre-silicon emulation.
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Professional Video Gear: Real-time 8K/4K image reconstruction and conversion.
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통신: High-bandwidth switching fabrics and protocol acceleration.
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Advanced Instrumentation: High-speed data acquisition and real-time analysis for scientific research.
