XC4VLX200-11FFG1513C

Produsen: Xilinx
Sel Logika: 178,176?(~200K system gates)
Irisan Logika: 22,272
RAM tertanam (eRAM): 6,193 Kb (~336 × 18Kb Block RAM)
Paket: FFG1513 (Flip?Chip BGA)
Suhu Pengoperasian: Komersial (0°C hingga +85°C)

KIRIMKAN PESAN KEPADA KAMI

    Spesifikasi

    MODEL P / N SERI JUMLAH LABORATORIUM/CLBS TINGKAT KECEPATAN JUMLAH ELEMEN / SEL LOGIKA TOTAL BIT RAM JUMLAH I / O TEGANGAN - PASOKAN JENIS PEMASANGAN SUHU PENGOPERASIAN PAKET / KASUS PAKET PERANGKAT PEMASOK
    XC4VLX200-11FFG1513C Virtex-4 LX 22.272,00 -11,00 200448 6193152 960 1,14 V ~ 1,26 V Pemasangan di Permukaan 0°C ~ +85°C (Komersial) 1513-BBGA (FCBGA) 1513-FCBGA

    XC4VLX200-11FFG1513C: The Performance Pinnacle of High-Density Logic Integration

    The XC4VLX200-11FFG1513C is the highest-specification, high-density FPGA in the Xilinx Virtex®-4 LX family. Built on the 90nm ASMBL™ (Blok Modular Silikon Tingkat Lanjut) architecture, this device is engineered for architects who require the absolute maximum logic capacity paired with the superior -11 tingkat kecepatan. It is the industry-standard choice for complex, logic-heavy applications where timing closure and single-chip integration are critical.

    Featuring a staggering 200,448 Logic Cells and the fastest commercial speed grade, the LX200-11 is designed to push the boundaries of real-time data processing and large-scale system emulation.

    Key Engineering Advantages

    • Fastest Timing Closure (-11 Speed Grade): The -11 speed grade is essential for high-performance designs, providing a significant frequency boost over the standard -10 models. This extra headroom is vital for stabilizing 300MHz+ internal logic fabrics and high-speed memory interfaces.

    • Konsolidasi Logika Besar-besaran: With over 200k logic cells, this FPGA allows for the integration of entire multi-processor systems, complex encryption engines, and massive state machines into a single die, eliminating the latency and complexity of multi-chip partitioning.

    • Unrivaled I/O Capacity: Bertempat di FFG1513 package, the device provides 960 User I/Os. This allows for massive parallel throughput, easily supporting multiple wide-bus interfaces like DDR2/QDR-II and high-speed backplane protocols.

    • High-Performance DSP & Memory: Termasuk 6,048 Kb of Block RAM dan 96 XtremeDSP™ slices. The combination of dense memory and dedicated arithmetic hardware makes it a powerhouse for real-time signal processing and 4K video algorithms.

    • RoHS Compliant Flip-Chip Packaging: The FFG1513 package is optimized for both environmental compliance and thermal integrity. Its design ensures low-inductance power delivery and superior heat dissipation, even at high switching frequencies.


    Matriks Spesifikasi Teknis

    Fitur Spesifikasi
    Sel Logika 200,448
    Array CLB 22,512
    Total Blok RAM 6,048 Kb
    Irisan DSP48 96
    I / O Pengguna Maks 960
    Tingkat Kecepatan -11 (Kinerja Tinggi)
    Tingkat Suhu Komersial (0°C hingga +85°C)
    Paket FFG1513 (Lead-Free / 1.0mm Pitch)

    Why Specify the LX200-11C?

    1. Solving the Routing Congestion Challenge

    In many high-density designs, routing congestion can kill timing. The Virtex-4 ASMBL architecture in the LX200 ensures a highly uniform distribution of logic, memory, and I/O. Combined with the -11 tingkat kecepatan, this allows for much easier timing closure on designs that utilize 85% or more of the available logic resources.

    2. Signal Integrity at Scale

    Driving nearly 1,000 I/Os simultaneously requires a robust power distribution network. The FFG1513 package is specifically designed with an extensive array of VCC and GND pins to suppress Kebisingan Peralihan Serentak (SSN), ensuring clean signal eyes for high-speed differential and single-ended signaling.

    3. Long-Lifecycle Stability

    The LX200-11C is a proven, mature platform. For mission-critical commercial systems—such as high-end medical scanners or broadcasting switchers—the stability of the Virtex-4 toolchain and the known reliability of the 90nm process provide a low-risk path to production.


    Aplikasi Target

    • ASIC/SoC Prototyping: Large-scale logic verification and pre-silicon emulation.

    • Professional Video Gear: Real-time 8K/4K image reconstruction and conversion.

    • Telekomunikasi: High-bandwidth switching fabrics and protocol acceleration.

    • Advanced Instrumentation: High-speed data acquisition and real-time analysis for scientific research.