XC5VFX70T-1FF1136I

Производитель: Xilinx
Логические ячейки: 71,680
Логические срезы: ~5,600
Встроенная оперативная память (eRAM): 5,456 Kb (~152 × 36Kb Block RAM)
Упаковка: FF1136 (Fine?Pitch BGA)
Рабочая температура: Коммерческий (от 0°C до +85°C)

ОТПРАВИТЬ НАМ СООБЩЕНИЕ

    Технические характеристики

    МОДЕЛЬ П/Н СЕРИИ КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ УРОВЕНЬ СКОРОСТИ КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК ВСЕГО БИТОВ ОЗУ КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ НАПРЯЖЕНИЕ - ПИТАНИЕ ТИП КРЕПЛЕНИЯ РАБОЧАЯ ТЕМПЕРАТУРА УПАКОВКА / КЕЙС УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА
    XC5VFX70T-1FF1136I Virtex-5 FXT 5.600,00 -1,00 71680 5455872 640 0.95 V–1.05 V Монтаж на поверхность -40 °C ~ +100 °C 1136-FBGA / FCBGA 1136-FCBGA (≈31×31 mm)

    Xilinx XC5VFX70T-1FF1136I | Virtex-5 FXT Industrial Leaded FPGA

    Сайт XC5VFX70T-1FF1136I is a high-reliability FPGA designed for industrial and mission-critical embedded systems. As part of the Virtex-5 FXT platform, it integrates a hard-core PowerPC® 440 processor и Трансиверы RocketIO™ GTX for high-speed serial communication.

    Significantly, this model features the FF1136 Leaded (Sn/Pb) package, which is the preferred choice for aerospace and defense applications requiring superior solder joint reliability under extreme mechanical stress. LXB Semicon provides fully verified, original XC5VFX70T-1FF1136I units with comprehensive quality assurance for our global partners.

    Core Technical Specifications

    The XC5VFX70T delivers a robust balance of processing power and high-speed connectivity:

    Характеристика Detailed Specification
    Логические ячейки 71,680
    Embedded Processor 1 x PowerPC® 440 (Hard Core)
    RocketIO™ GTX 16 Transceivers (supporting up to 6.5 Gbps)
    Рабочая температура -40°C to +100°C (Industrial Grade)
    Пакет FF1136 (Standard Leaded BGA / Sn-Pb)
    Ломтики DSP48E 128
    Total Block RAM 5,328 Kb
    Степень скорости -1 (Standard)

    Why the XC5VFX70T-1FF1136I is Essential for Mission-Critical Systems

    In specialized engineering sectors, the “FX70T” in an Industrial Leaded package offers unique advantages:

    1. Leaded (Sn/Pb) Reliability

    Unlike RoHS-compliant parts, the FF1136 package uses tin-lead solder balls. This is critical for preventing “tin whiskers” and ensuring the longevity of solder joints in high-vibration environments, such as avionics or military transport.

    2. Dual-Environment Processing

    The integrated PowerPC 440 allows for high-level control-plane tasks (running RTOS like VxWorks or Linux) while the FPGA fabric handles real-time data-plane acceleration. This architecture minimizes component count and maximizes system efficiency.

    3. Industrial Temperature Resilience

    Rated for -40°C to +100°C, this device is screened for stability. It is the primary choice for outdoor telecommunications infrastructure and heavy-duty industrial automation where commercial chips cannot survive.

    4. Versatile Serial Bandwidth

    With 16 GTX transceivers, it supports high-bandwidth protocols (PCIe, Serial RapidIO, SATA) with industry-leading signal integrity, even in electromagnetically noisy environments.


    Key Application Sectors

    • Аэрокосмическая и оборонная промышленность: Secure flight control computers and radar signal processing.

    • Railway & Infrastructure: Safety-critical signaling and control systems.

    • High-End Industrial: Robotics and complex motion controllers operating in extreme climates.

    • Test & Simulation: Hardware-in-the-loop (HIL) simulators requiring deterministic performance.


    LXB Semicon: Your Trusted Partner for High-Reliability Silicon

    Sourcing a specific leaded industrial FPGA like the XC5VFX70T-1FF1136I requires a supplier who understands the gravity of the application. LXB Semicon guarantees:

    • 100% Originality: We exclusively supply genuine Xilinx (now AMD) silicon. Every part is verified through a multi-point quality check in our ESD-safe facility.

    • Solder Integrity Inspection: We perform high-resolution optical inspections on the BGA array to ensure no oxidation or ball damage, which is vital for leaded components.

    • Full Traceability: We offer Date Code (D/C) and Lot Code transparency to support your quality management systems and industrial auditing.

    • Expert Packaging: Shipped in vacuum-sealed moisture-barrier bags (MBB) with desiccant, ensuring MSL compliance and readiness for your assembly line.


    ЧАСТО ЗАДАВАЕМЫЕ ВОПРОСЫ

    Q: Is the XC5VFX70T-1FF1136I RoHS compliant?

    A: No. This is the FF1136 package, which contains lead (Sn/Pb). For the RoHS-compliant/Lead-Free version, please inquire about the FFG1136 model.

    Q: What software is needed for development?

    A: This device is supported by Xilinx ISE® Design Suite (14.7). It is not compatible with the Vivado® platform.

    Q: Can I use this part to replace a Commercial grade chip?

    A: Yes. The industrial version covers the commercial temperature range and provides higher reliability. However, ensure your assembly process is compatible with leaded solder balls.


    Request a Fast Quote from LXB Semicon

    Looking for immediate availability or competitive pricing for the XC5VFX70T-1FF1136I? Contact our expert procurement team today.