xc5vvfx70t-1ff1136i

الشركة المصنعة: زيلينكس
الخلايا المنطقية: 71,680
شرائح المنطق: ~5,600
ذاكرة الوصول العشوائي المدمجة (eRAM): 5,456 Kb (~152 × 36Kb Block RAM)
الحزمة: FF1136 (غرامة؟ الملعب BGA)
درجة حرارة التشغيل: تجاري (0 درجة مئوية إلى +85 درجة مئوية)

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    المواصفات

    الطراز P/N السلسلة عدد المعامل/المختبرات درجة السرعة عدد العناصر/الخلايا المنطقية إجمالي بتات ذاكرة الوصول العشوائي (RAM) عدد الإدخال/الإخراج الجهد - الإمداد نوع التركيب درجة حرارة التشغيل العبوة / العلبة حزمة جهاز المورد
    xc5vvfx70t-1ff1136i Virtex-5 FXT 5.600,00 -1,00 71680 5455872 640 0.95 فولت - 1.05 فولت التركيب على السطح -40 درجة مئوية ~ +100 درجة مئوية 1136-FBGA/FCBGA/1136 1136-FCBGA (≈31×31 مم)

    Xilinx XC5VFX70T-1FF1136I | Virtex-5 FXT Industrial Leaded FPGA

    إن xc5vvfx70t-1ff1136i is a high-reliability FPGA designed for industrial and mission-critical embedded systems. As part of the Virtex-5 FXT platform, it integrates a hard-core معالج PowerPC® 440 و أجهزة الإرسال والاستقبال RocketIO™ GTX for high-speed serial communication.

    Significantly, this model features the FF1136 Leaded (Sn/Pb) package, which is the preferred choice for aerospace and defense applications requiring superior solder joint reliability under extreme mechanical stress. LXB Semicon provides fully verified, original XC5VFX70T-1FF1136I units with comprehensive quality assurance for our global partners.

    المواصفات الفنية الأساسية

    The XC5VFX70T delivers a robust balance of processing power and high-speed connectivity:

    الميزة المواصفات التفصيلية
    الخلايا المنطقية 71,680
    المعالج المدمج 1 × PowerPC® 440 (صلب) 1 × 440 (صلب)
    RocketIO™ GTX 16 Transceivers (supporting up to 6.5 Gbps)
    درجة حرارة التشغيل -40 درجة مئوية إلى +100 درجة مئوية (درجة صناعية)
    الحزمة FF1136 (Standard Leaded BGA / Sn-Pb)
    شرائح DSP48E 128
    إجمالي كتلة ذاكرة الوصول العشوائي (RAM) 5,328 كيلو بايت
    درجة السرعة -1 (قياسي)

    Why the XC5VFX70T-1FF1136I is Essential for Mission-Critical Systems

    In specialized engineering sectors, the “FX70T” in an Industrial Leaded package offers unique advantages:

    1. Leaded (Sn/Pb) Reliability

    Unlike RoHS-compliant parts, the FF1136 package uses tin-lead solder balls. This is critical for preventing “tin whiskers” and ensuring the longevity of solder joints in high-vibration environments, such as avionics or military transport.

    2. Dual-Environment Processing

    The integrated PowerPC 440 allows for high-level control-plane tasks (running RTOS like VxWorks or Linux) while the FPGA fabric handles real-time data-plane acceleration. This architecture minimizes component count and maximizes system efficiency.

    3. Industrial Temperature Resilience

    Rated for -40 درجة مئوية إلى +100 درجة مئوية, this device is screened for stability. It is the primary choice for outdoor telecommunications infrastructure and heavy-duty industrial automation where commercial chips cannot survive.

    4. Versatile Serial Bandwidth

    With 16 GTX transceivers, it supports high-bandwidth protocols (PCIe, Serial RapidIO, SATA) with industry-leading signal integrity, even in electromagnetically noisy environments.


    Key Application Sectors

    • الطيران والفضاء والدفاع: Secure flight control computers and radar signal processing.

    • Railway & Infrastructure: Safety-critical signaling and control systems.

    • High-End Industrial: Robotics and complex motion controllers operating in extreme climates.

    • Test & Simulation: Hardware-in-the-loop (HIL) simulators requiring deterministic performance.


    LXB Semicon: Your Trusted Partner for High-Reliability Silicon

    Sourcing a specific leaded industrial FPGA like the xc5vvfx70t-1ff1136i requires a supplier who understands the gravity of the application. LXB Semicon الضمانات:

    • 100% أصالة: We exclusively supply genuine Xilinx (now AMD) silicon. Every part is verified through a multi-point quality check in our ESD-safe facility.

    • Solder Integrity Inspection: We perform high-resolution optical inspections on the BGA array to ensure no oxidation or ball damage, which is vital for leaded components.

    • إمكانية التتبع الكاملة: We offer Date Code (D/C) and Lot Code transparency to support your quality management systems and industrial auditing.

    • Expert Packaging: Shipped in vacuum-sealed moisture-barrier bags (MBB) with desiccant, ensuring MSL compliance and readiness for your assembly line.


    الأسئلة الشائعة

    Q: Is the XC5VFX70T-1FF1136I RoHS compliant?

    A: No. This is the FF1136 package, which contains lead (Sn/Pb). For the RoHS-compliant/Lead-Free version, please inquire about the FFG1136 model.

    Q: What software is needed for development?

    A: هذا الجهاز مدعوم من مجموعة تصميم Xilinx ISE® Design Suite (14.7). It is not compatible with the Vivado® platform.

    Q: Can I use this part to replace a Commercial grade chip?

    A: Yes. The industrial version covers the commercial temperature range and provides higher reliability. However, ensure your assembly process is compatible with leaded solder balls.


    اطلب عرض أسعار سريع من LXB Semicon

    Looking for immediate availability or competitive pricing for the xc5vvfx70t-1ff1136i? Contact our expert procurement team today.