XC5VFX70T-1FF1136I

Produsen: Xilinx
Sel Logika: 71,680
Irisan Logika: ~5,600
RAM tertanam (eRAM): 5,456 Kb (~152 × 36Kb Block RAM)
Paket: FF1136 (Fine? Pitch BGA)
Suhu Pengoperasian: Komersial (0°C hingga +85°C)

KIRIMKAN PESAN KEPADA KAMI

    Spesifikasi

    MODEL P / N SERI JUMLAH LABORATORIUM/CLBS TINGKAT KECEPATAN JUMLAH ELEMEN / SEL LOGIKA TOTAL BIT RAM JUMLAH I / O TEGANGAN - PASOKAN JENIS PEMASANGAN SUHU PENGOPERASIAN PAKET / KASUS PAKET PERANGKAT PEMASOK
    XC5VFX70T-1FF1136I Virtex-5 FXT 5.600,00 -1,00 71680 5455872 640 0,95 V-1,05 V Pemasangan di Permukaan -40 ° C ~ +100 ° C 1136-FBGA / FCBGA 1136-FCBGA (≈31×31 mm)

    Xilinx XC5VFX70T-1FF1136I | Virtex-5 FXT Industrial Leaded FPGA

    The XC5VFX70T-1FF1136I is a high-reliability FPGA designed for industrial and mission-critical embedded systems. As part of the Virtex-5 FXT platform, it integrates a hard-core Prosesor PowerPC® 440 dan Transceiver RocketIO™ GTX for high-speed serial communication.

    Significantly, this model features the FF1136 Leaded (Sn/Pb) package, which is the preferred choice for aerospace and defense applications requiring superior solder joint reliability under extreme mechanical stress. LXB Semicon provides fully verified, original XC5VFX70T-1FF1136I units with comprehensive quality assurance for our global partners.

    Spesifikasi Teknis Inti

    The XC5VFX70T delivers a robust balance of processing power and high-speed connectivity:

    Fitur Spesifikasi Detail
    Sel Logika 71,680
    Prosesor Tertanam 1 x PowerPC® 440 (Inti Keras)
    RocketIO™ GTX 16 Transceivers (supporting up to 6.5 Gbps)
    Suhu Pengoperasian -40°C hingga +100°C (Kelas Industri)
    Paket FF1136 (Standard Leaded BGA / Sn-Pb)
    Irisan DSP48E 128
    Total Blok RAM 5,328 Kb
    Tingkat Kecepatan -1 (Standar)

    Why the XC5VFX70T-1FF1136I is Essential for Mission-Critical Systems

    In specialized engineering sectors, the “FX70T” in an Industrial Leaded package offers unique advantages:

    1. Leaded (Sn/Pb) Reliability

    Unlike RoHS-compliant parts, the FF1136 package uses tin-lead solder balls. This is critical for preventing “tin whiskers” and ensuring the longevity of solder joints in high-vibration environments, such as avionics or military transport.

    2. Dual-Environment Processing

    The integrated PowerPC 440 allows for high-level control-plane tasks (running RTOS like VxWorks or Linux) while the FPGA fabric handles real-time data-plane acceleration. This architecture minimizes component count and maximizes system efficiency.

    3. Industrial Temperature Resilience

    Rated for -40°C hingga +100°C, this device is screened for stability. It is the primary choice for outdoor telecommunications infrastructure and heavy-duty industrial automation where commercial chips cannot survive.

    4. Versatile Serial Bandwidth

    With 16 GTX transceivers, it supports high-bandwidth protocols (PCIe, Serial RapidIO, SATA) with industry-leading signal integrity, even in electromagnetically noisy environments.


    Key Application Sectors

    • Kedirgantaraan & Pertahanan: Secure flight control computers and radar signal processing.

    • Railway & Infrastructure: Safety-critical signaling and control systems.

    • High-End Industrial: Robotics and complex motion controllers operating in extreme climates.

    • Test & Simulation: Hardware-in-the-loop (HIL) simulators requiring deterministic performance.


    LXB Semicon: Your Trusted Partner for High-Reliability Silicon

    Sourcing a specific leaded industrial FPGA like the XC5VFX70T-1FF1136I requires a supplier who understands the gravity of the application. LXB Semicon guarantees:

    • 100% Originality: We exclusively supply genuine Xilinx (now AMD) silicon. Every part is verified through a multi-point quality check in our ESD-safe facility.

    • Solder Integrity Inspection: We perform high-resolution optical inspections on the BGA array to ensure no oxidation or ball damage, which is vital for leaded components.

    • Ketertelusuran Penuh: We offer Date Code (D/C) and Lot Code transparency to support your quality management systems and industrial auditing.

    • Expert Packaging: Shipped in vacuum-sealed moisture-barrier bags (MBB) with desiccant, ensuring MSL compliance and readiness for your assembly line.


    PERTANYAAN YANG SERING DIAJUKAN

    Q: Is the XC5VFX70T-1FF1136I RoHS compliant?

    A: No. This is the FF1136 package, which contains lead (Sn/Pb). For the RoHS-compliant/Lead-Free version, please inquire about the FFG1136 model.

    Q: What software is needed for development?

    A: Perangkat ini didukung oleh Xilinx ISE® Design Suite (14.7). It is not compatible with the Vivado® platform.

    Q: Can I use this part to replace a Commercial grade chip?

    A: Yes. The industrial version covers the commercial temperature range and provides higher reliability. However, ensure your assembly process is compatible with leaded solder balls.


    Minta Penawaran Cepat dari LXB Semicon

    Looking for immediate availability or competitive pricing for the XC5VFX70T-1FF1136I? Contact our expert procurement team today.