XC4VLX100-11FFG1148I

Производитель: Xilinx
Логические ячейки: 110,592
Логические срезы: 49,152
Встроенная оперативная память (eRAM): 4,320 Kb (240 × 18Kb Block RAM)
Упаковка: FFG1148 (Flip?Chip BGA)
Рабочая температура: Промышленные (от -40°C до +100°C)

ОТПРАВИТЬ НАМ СООБЩЕНИЕ

    Технические характеристики

    МОДЕЛЬ П/НСЕРИИКОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБУРОВЕНЬ СКОРОСТИКОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕКВСЕГО БИТОВ ОЗУКОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВНАПРЯЖЕНИЕ - ПИТАНИЕТИП КРЕПЛЕНИЯРАБОЧАЯ ТЕМПЕРАТУРАУПАКОВКА / КЕЙСУПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА
    XC4VLX100-11FFG1148IVirtex-4 LX11.520,00-11,009984044789767681,14 V ~ 1,26 VМонтаж на поверхность-40 °C ~ +100 °C (промышленный)1148-BBGA (FCBGA)1148-FCBGA

    XC4VLX100-11FFG1148I: The High-Speed Industrial Benchmark for Large-Scale Logic

    Сайт XC4VLX100-11FFG1148I is a high-performance, industrial-grade FPGA designed for mission-critical systems that demand both massive logic density and uncompromising timing precision. Built on Xilinx’s proven 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device offers 110,592 Logic Cells binned for the premium -11 speed grade.

    Engineered for Industrial-grade (-40°C to +100°C) operation, this FPGA is the definitive choice for architects who need to maintain 300MHz+ internal clock frequencies in environments where thermal fluctuations and long-term reliability are non-negotiable.

    Core Engineering Highlights

    • Peak -11 Speed Grade: The -11 grade provides significantly faster switching and reduced propagation delays compared to standard models. This extra timing headroom is critical for complex, high-utilization RTL designs where setup-and-hold closure is often the primary bottleneck.

    • Industrial Temperature Resilience: Rated for -40°C to +100°C junction temperature. This ensures that timing models remain valid even in high-heat industrial enclosures or unconditioned outdoor telecommunications cabinets.

    • High-Bandwidth I/O Management: Сайт FFG1148 package breaks out 768 User I/Os. Supporting Xilinx’s SelectIO™ technology, it facilitates clean, high-speed interfacing with multiple DDR2/QDR-II memory banks and high-width parallel system buses.

    • Integrated XtremeDSP™ Blocks: Equipped with 96 DSP48 slices. These dedicated hardware multipliers and accumulators allow for intensive arithmetic operations (up to 400MHz+) without taxing the general-purpose logic fabric—essential for real-time filtering and sensor fusion.

    • High-Density Memory Hierarchy: Характеристики 4,320 Kb of Block RAM (BRAM), providing the low-latency buffering and deep FIFO structures required for high-throughput stream processing and localized data caching.


    Technical Specification Matrix

    ХарактеристикаТехнические характеристики
    Логические ячейки110,592
    Configurable Logic Blocks (CLBs)12,480
    Total Block RAM4,320 Kb
    DSP48 Slices96
    Maximum User I/O768
    Степень скорости-11 (Premium High-Performance)
    Temperature GradeПромышленные (от -40°C до +100°C)
    ПакетFFG1148 (Lead-Free Flip-Chip BGA)

    Why Specify the LX100-11I?

    1. Predictable Reliability in Saturated Designs

    When logic utilization pushes past 80%, routing congestion usually kills timing. The combination of the ASMBL architecture and the -11 speed grade mitigates this “congestion penalty,” ensuring that your critical paths meet their frequency targets even when the chip is nearly full.

    2. Superior Signal Integrity

    Сайт FFG1148 Flip-Chip package is designed to minimize parasitic inductance. The dense grid of power and ground pins helps suppress Simultaneous Switching Noise (SSN), providing the clean signal integrity required for robust, high-speed differential and single-ended signaling.

    3. Long-Lifecycle Product Stability

    The Virtex-4 series is a cornerstone of high-reliability industries. For projects requiring a 10-15 year service life—such as power grid monitoring, aerospace ground equipment, or medical imaging backplanes—the LX100-11I offers a proven track record and a well-documented toolchain.


    Приложения

    • Industrial Automation: High-precision robotics, motion control hubs, and multi-axis synchronizers.

    • Telecommunications: Outdoor base station signal processing and protocol conversion.

    • Defense & Aerospace: Ground support systems and secure communication bridges.

    • Medical Systems: Real-time data acquisition and reconstruction backends for CT/MRI scanners.