XCKU5P-2FFVB676I

Manufacturer: AMD / Xilinx
Logic Cells: 2,540,000
Logic Slices: 158,000
Embedded RAM (eRAM): 190,000 Kb
Package: FFVB676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C TJ)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCKU5P-2FFVB676I Kintex UltraScale+ 27,12 -2,00 474,600 LE 41.98 Mbit 280 0.825V ~ 0.876V Surface Mount 0 °C ~ 100 °C 676-BBGA / FCBGA 676-FCBGA (27×27)