XCKU035-1FBVA676C

Manufacturer: AMD / Xilinx
Logic Cells: 1,326,480
Logic Slices: 82,000
Embedded RAM (eRAM): 75,000 Kb
Package: FBVA676 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C TJ)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCKU035-1FBVA676C Kintex® UltraScale 25,39 -1,00 444,343 LE 19,456,000 bits 312 0.922 V – 0.979 V Surface Mount 0 °C – 85 °C FCBGA-676 676-FCBGA (27×27)