XCKU035-1FBVA676C

Manufacturer: AMD / Xilinx
Logic Cells: 1,326,480
Logic Slices: 82,000
Embedded RAM (eRAM): 75,000 Kb
Package: FBVA676 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C TJ)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XCKU035-1FBVA676CKintex® UltraScale25,39-1,00444,343 LE19,456,000 bits3120.922 V – 0.979 VSurface Mount0 °C – 85 °CFCBGA-676676-FCBGA (27×27)