XC7Z045-L2FFG676I

Manufacturer: AMD / Xilinx
Logic Cells: 350,000
Logic Slices: 54,650
Embedded RAM (eRAM): 19,200 Kb (б╓ 534 × 36Kb Block RAM)
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Low-Power Industrial (-40°C to +100°C TJ)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7Z045-L2FFG676I Zynq-7000 SoC 0,00 0,00 350,000 LE 20117760 250 0.97 – 1.03 V Surface mount −40 °C — 100 °C FFG-676 / FCBGA-676 676-FCBGA