XC7Z035-1FFG900C

Manufacturer: Xilinx
Logic Cells: 275,000
Logic Slices: 34,400
Embedded RAM (eRAM): 17,280 Kb (480 × 36Kb Block RAM)
Package: FFG900 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7Z035-1FFG900C Zynq-7000 0,00 -1,00 ~275,000 LE 362 FCBGA-900 0 °C ~ 85 °C 900-BBGA 900-FCBGA (31×31)