XC7Z035-1FFG676I

Manufacturer: Xilinx
Logic Cells: 275,000
Logic Slices: 34,400
Embedded RAM (eRAM): 17,280 Kb (480 × 36Kb Block RAM)
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7Z035-1FFG676I Zynq-7000 SoC 42,98 -1,00 275,000 LE 17600000 0 1.0 V SMD/SMT Industrial (-40 °C … 100 °C) FCBGA-676 FCBGA-676