XC7Z035-1FFG676I

Manufacturer: Xilinx
Logic Cells: 275,000
Logic Slices: 34,400
Embedded RAM (eRAM): 17,280 Kb (480 × 36Kb Block RAM)
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7Z035-1FFG676IZynq-7000 SoC42,98-1,00275,000 LE1760000001.0 VSMD/SMTIndustrial (-40 °C … 100 °C)FCBGA-676FCBGA-676