XC7Z035-1FBG676C

Manufacturer: Xilinx
Logic Cells: 275,000
Logic Slices: 34,400
Embedded RAM (eRAM): 17,280 Kb (480 × 36Kb Block RAM)
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7Z035-1FBG676CZynq-7000 SoC0,00-1,00275,000 LE17,600,0002120.97 – 1.03 VSurface mount0 °C — 85 °CFBG/FFG-676676-FCBGA (27×27 mm)