XC7K410T-3FFG676E

Manufacturer: Xilinx
Logic Cells: 406,720
Logic Slices: 63,550
Embedded RAM (eRAM): 28,620 Kb (795 × 36Kb Block RAM)
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Extended (-40°C to +125°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7K410T-3FFG676E Kintex-7 31.775,00 -3,00 406,720 29306880 400 0.97 ~ 1.03 V Surface Mount 0 °C ~ 100 °C 676-BBGA, FCBGA 676-FCBGA (27×27)