XC7K410T-3FBG676E

Manufacturer: Xilinx
Logic Cells: 406,720
Logic Slices: 63,550
Embedded RAM (eRAM): 28,620 Kb (795 × 36Kb Block RAM)
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Extended (-40°C to +125°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7K410T-3FBG676EKintex-731.775,00-3,00406,720293068804000.97 ~ 1.03Surface Mount0 °C ~ 100 °C (E)676-FCBGA676-FCBGA (27×27)