XC7K325T-1FFG676I

Manufacturer: Xilinx
Logic Cells: 326,080
Logic Slices: 51,200
Embedded RAM (eRAM): 12,288 Kb
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7K325T-1FFG676I Kintex-7 25.475,00 -1,00 326,080 16404480 400 0.97 – 1.03 V (typ 1.0 V) Surface mount −40 °C — 100 °C 676-FBGA/FCBGA 676-FCBGA (27×27)