XC7K160T-2FBG676I

Manufacturer: Xilinx
Logic Cells: 160,000
Logic Slices: 25,600
Embedded RAM (eRAM): 4,320 Kb
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7K160T-2FBG676I Kintex-7 12.675,00 -2,00 162,240 11980800 400 0.97 – 1.03 V (typ 1.0 V) Surface mount −40 °C — 100 °C 676-FBGA/FCBGA 676-FCBGA (27×27)