| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VLX50-1FFG676C | Virtex-5 LX | 3,60 | -1,00 | 46080 | 1769472 | 440 | 0.95 V – 1.05 V | Surface Mount | 0 °C – +85 °C (C) | 676-FBGA / FCBGA | 676-FCBGA (≈27 × 27 mm) |
XC5VLX50-1FFG676C
Manufacturer: Xilinx Logic Cells: 51,840 Logic Slices: 8,160 Embedded RAM (eRAM): 2,448 Kb (136 × 18Kb Block RAM) Package: FFG676 (Flip-Chip BGA) Operating Temperature: Commercial (0°C to +85°C)
Specifications
XC5VLX330-1FFG1760I is a high-density FPGA designed for complex and large-scale applications requiring massive logic resources.
Key Features
- Up to 330K logic cells
- High I/O count
- Industrial-grade performance
- Advanced system integration
Technical Specifications
- Package: FFG1760
- Speed Grade: -1
- Temperature: -40°C to +100°C
Cross Reference
- XC5VLX330-1FFG1760C
- XC5VLX220-1FFG1760I
Applications
- Telecom infrastructure
- Data centers
- Military & industrial systems
Stock Availability
🔥 Rare stock available
⏳ Long lead time expected
Call to Action
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