XC5VLX330-2FFG1760C

Manufacturer: Xilinx
Logic Cells: 331,776
Logic Slices: 51,840
Embedded RAM (eRAM): 11,664 Kb (648 × 18Kb Block RAM)
Maximum User I/O: 768
Package: FFG1760 (Flip-Chip BGA)
Speed Grade: -2
Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC5VLX330-2FFG1760CVirtex-5 LX33025.920,00-2,00331776106168321.2000.95 V – 1.05 VSurface Mount0 °C ~ 85 °C (TJ)1760-BBGA, FCBGA1760-FCBGA (42.5 × 42.5 mm)