XC5VLX30-2FFG676I

Manufacturer: Xilinx Logic Cells: 30,720 Logic Slices: 4,800 Embedded RAM (eRAM): 1,728 Kb (96 × 18Kb Block RAM) Package: FFG676 (Flip-Chip BGA) Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC5VLX30-2FFG676IVirtex-5 LX2.400,00-2,003072011796484000.95 V – 1.05 VSurface Mount-40 °C – +100 °C (I)676-FBGA / FCBGA676-FCBGA (≈27 × 27 mm)

    The XC5VLX30-2FFG676I offers the same compact architecture as the LX30 family, with a higher speed grade for improved timing performance in industrial environments.

    Key Features

    • Industrial-grade reliability

    • Improved timing performance (-2 speed grade)

    • Stable long-term deployment

    Applications

    • Real-time control systems

    • Industrial signal processing

    • Embedded computing