| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX60-11FFG668C | Virtex-4 LX | 6.656,00 | -11,00 | 59904LE | 2949120 | 448 | 1.14 V ~ 1.26 V | Surface Mount | Commercial (0°C ~ +85°C) | 668-BBGA, FCBGA | 668-FCBGA (27×27) |
XC4VLX60-11FFG668C: High-Performance Virtex-4 LX Logic Workhorse
The XC4VLX60-11FFG668C is a high-density, high-speed member of the Xilinx Virtex-4 LX family. Optimized for logic-intensive tasks, this FPGA provides 59,904 logic cells in the versatile FFG668 footprint. The -11 speed grade is the critical differentiator here, offering reduced propagation delays and higher clock frequency capabilities compared to the base -10 grade.
This part is primarily utilized in systems requiring massive logic gate counts—such as medical imaging signal chains, high-end industrial automation controllers, and legacy communication gateways—where meeting tight timing margins is non-negotiable.
Technical Core Specifications
Logic Cells: 59,904
CLB Array: 64 x 96
Total Block RAM: 2,880 Kb (Organized in 18 Kb blocks)
DSP48 Slices: 64
Maximum User I/O: 448
Package: FFG668 (Fine-pitch Flip-Chip BGA, 1.0mm pitch, RoHS Compliant)
Speed Grade: -11
Temperature Range: Commercial (0°C to +85°C Junction Temperature)
Design & Engineering Implementation Insights
1. Timing Margin and the -11 Bin
The -11 speed grade provides approximately a 10% performance boost over the -10. While this helps in closing timing on congested routing paths, engineers should perform a full Static Timing Analysis (STA) to ensure that hold-time ($T_h$) margins are still respected, as the faster silicon speed decreases data path delays.
2. Thermal and Power Management
The Virtex-4 LX60, built on 90nm technology, exhibits higher static leakage than modern 7-series or UltraScale parts. With nearly 60k logic cells switching at -11 speeds, the FFG668 package requires a clean thermal path. Ensure that your heatsink and TIM (Thermal Interface Material) are rated for the localized power density of the LX60 fabric.
3. I/O Banking and Voltage (SelectIO)
The 448 user I/Os support over 20 different signaling standards. When maintaining or repairing existing hardware, double-check that your $V_{CCO}$ rail assignments match the banking rules of the original bitstream. The Flip-Chip (FFG) package design offers low package inductance, which is vital for maintaining signal integrity at the -11 speed grade’s faster edge rates.
4. Legacy Software Requirements
The XC4VLX60 is not supported by Vivado. You must use Xilinx ISE Design Suite (version 14.7). For maintenance and new bitstream generation, ensure you are utilizing the correct speed-file updates for the -11 silicon to ensure accurate timing simulation.
Comparison: Virtex-4 LX60 Speed Grade Options
| Feature | XC4VLX60-11FFG668C | XC4VLX60-10FFG668C |
| Logic Performance | High-Speed (-11) | Standard (-10) |
| Setup Time ($T_{su}$) | Shorter / Better | Standard |
| Application Suitability | Timing-Critical / High Freq | General Logic / Cost-Sensitive |
| Bitstream Compatibility | Yes (Requires Timing Re-run) | Base Reference |
Hardware Engineer’s FAQ
Can the XC4VLX60-11FFG668C replace a -10 grade part?
Yes. Xilinx speed grades are backward compatible. A faster -11 part will easily handle the timing requirements of a -10 design. This is a common strategy for improving yield or stability in aging hardware.
Is this part RoHS compliant?
Yes. The “G” in FFG668 signifies a lead-free package. If your repair involves an older board originally using leaded (FF668) parts, this part is footprint-compatible, but you must use lead-free reflow profiles (e.g., SAC305) for proper solder joint integrity.
How do you verify the integrity of these mature parts?
We understand that the Virtex-4 is a mature product. We provide parts with verifiable Date Codes, and each batch undergoes visual inspection and marking verification. Additional testing (X-ray or Solderability) is available upon request for high-reliability applications.
Need a technical quote or a specific Date Code for a long-lifecycle program?
We focus on providing traceable, original Xilinx silicon for mission-critical maintenance and production.
Would you like me to pull the specific power-on sequence requirements or the DCM (Digital Clock Manager) jitter specs for this -11 grade LX60?
Contact LXB Semicon for availability, pricing, and technical support.
