Specifications
KLM4G1FEPD‑B031 is a 4GB embedded flash memory chip manufactured by Samsung, fully compliant with JEDEC eMMC 5.0 specification, integrating MLC NAND flash array and dedicated storage management controller inside a single package to serve as built-in persistent storage for embedded intelligent devices.
Part Number Definition
KLM series stands for Samsung embedded eMMC storage product line. 4G denotes the nominal 4GB storage capacity. Subsequent codes define internal flash die structure and controller configuration. B031 indicates official hardware revision, electrical specification and packaging version. Factory standard tape-and-reel packaging is provided to support automatic PCB SMT mounting in mass production.
Core Storage & Interface Performance
The chip provides 4GB effective storage space with MLC 2-bit per cell flash architecture. It supports HS200 and HS400 high-speed transmission modes under eMMC 5.0 protocol. Typical sequential read speed reaches around 100MB/s, and sequential write speed meets the basic firmware burning and file storage demands of embedded systems. The on-board controller autonomously executes wear leveling, bad block detection and replacement, hardware ECC error correction, garbage collection and partition management functions, which hides low-level NAND operation logic from main processors and reduces software development workload. It supports multi-partition configuration, secure erase, sanitize operation and offline firmware update for the storage controller itself.
Power Supply Specifications
Dual voltage power supply design is adopted. The flash core array works at 3.3V, while the controller and signal I/O interface support 1.8V or 3.3V voltage selection, which can match the IO electrical level of different main control SoCs. Multiple low-power states including power-off notification and deep sleep mode are integrated to cut power consumption during standby and idle periods, suitable for battery-powered portable and IoT terminals.
Package and Mechanical Parameters
Package type is 153-ball FBGA fine pitch ball grid array package, with overall dimension 11mm × 10mm × 0.8mm. Moisture Sensitivity Level is MSL 3, and reflow soldering must be finished within 168 hours after opening vacuum moisture-proof packaging. Standard ball layout ensures stable solder joint performance during batch PCB assembly.
Environmental and Compliance Standards
Standard operating temperature range is -25℃ to +85℃, fitting consumer electronics and conventional industrial embedded equipment working environments. The component is produced with lead-free process and fully complies with RoHS and REACH environmental regulations without restricted hazardous substances. Optimized internal circuit layout enhances electromagnetic interference resistance to guarantee stable data reading and writing under conventional complex circuit conditions.
Typical Application Fields
Embedded development boards, industrial touch panels and small HMI equipment system firmware storage Smart refrigerators, household intelligent appliances and kitchen control mainboard local program memory IP cameras, low-end NVR front-end equipment and video monitoring terminal boot storage POS payment terminals, self-service vending machines and access control system built-in storage Set-top boxes, lightweight IoT gateways and handheld testing instruments program and parameter storage
LXB Semicon supplies original Samsung KLM4G1FEPD‑B031 4GB eMMC 5.0 flash memory IC
