Specifications
K4UBE3D4AB-MGCL is a high-performance low-power LPDDR4X mobile synchronous DRAM developed by Samsung Semiconductor, built on advanced low-leakage process technology, tailored for high-bandwidth, battery-sensitive intelligent terminal and embedded edge computing equipment.
Part Number Definition
K4UBE series belongs to Samsung LPDDR4X mainstream memory product lineup. Core coding defines 32Gbit storage density and 32-bit data bus width. MGCL specifies 4266Mbps maximum transfer rate, commercial temperature grade and standard FBGA packaging specification. Original factory adopts tape-and-reel packaging to support automatic PCB SMT mounting for mass production.
Core Architecture & Performance Parameters
Total memory density is 32Gbit, organized as 1G × 32bit. It strictly complies with JEDEC LPDDR4X protocol, with peak data transmission rate reaching 4266 Mbps per pin and base clock frequency at 2133MHz. It supports 16-bank internal architecture, 16n prefetch mechanism, write leveling, on-die termination ODT, ZQ impedance auto-calibration and bidirectional differential DQS strobe signal to enhance signal integrity under high-speed operation. Integrated hardware ECC error correction, temperature compensated self-refresh and automatic precharge functions greatly improve long-term data stability.
Multi-Rail Power Supply System
Three groups of independent power rails are adopted for optimized power management:
- VDD core array voltage: 0.6V typical operating range 0.57~0.65V
- VDD2 main logic power: 1.1V
- VDDQ IO interface voltage: 1.8V Dynamic voltage scaling is supported to cut power consumption under light load. Multiple low-power working modes including deep power down, self-refresh and power-down mode are embedded to minimize standby power draw and extend battery endurance of portable devices.
Package & Mechanical Specifications
Package form is 200-ball FBGA fine pitch ball grid array package. Moisture Sensitivity Level is MSL 3, and reflow soldering must be finished within 168 hours after opening vacuum moisture-proof packaging. Standard ball layout ensures consistent soldering yield during batch PCB assembly.
Environmental & Compliance Standards
Standard operating temperature range covers -25℃ to +85℃, suitable for consumer electronics and conventional industrial embedded devices. The chip is lead-free and halogen-free, fully compliant with RoHS and REACH environmental regulations without restricted hazardous substances. Optimized layout design restrains electromagnetic interference to guarantee stable memory access in complex circuit environments.
Typical Application Fields
Flagship smartphones, high-end tablets and lightweight two-in-one notebook onboard running memory RK/Allwinner embedded mainboards, commercial advertising machines and industrial human-machine touch panel system memory Vehicle infotainment hosts, car dashboard control units and automotive intelligent terminal cache memory Edge AI computing modules, intelligent surveillance cameras and miniature NVR video buffer memory Portable medical instruments, handheld testing equipment and low-power IoT gateway main memory
LXB Semicon supplies original Samsung K4UBE3D4AB-MGCL LPDDR4X SDRAM memory IC
