| Mfr Part | Series | Manufacturer | Package | Topology | Product Status | Mounting Type | Switching Frequency | Function | Input Voltage | Output Voltage | Number of Outputs | Operating Temperature | Output Type | Output Current |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HMC963LC4TR | RF | Analog Devices | SMT | Amplifier | Active | Surface Mount | N/A | RF Amplifier | 3 V | RF | 1 | -40°C to +85°C | RF | 90 mA |
HMC963LC4TR
Manufacturer: Analog Devices
Logic Cells: RF mixer IC
Logic Slices: Broadband frequency conversion circuitry
Embedded RAM (eRAM): –
Package: SMT
Operating Temperature: -40 °C to +85 °C
Specifications
This is a wideband monolithic microwave integrated circuit low noise amplifier developed by Analog Devices, built on GaAs pHEMT semiconductor process, specially designed for microwave millimeter wave radio frequency signal amplification in 6GHz to 26.5GHz frequency band.
Part Number Definition
HMC963 stands for core model of ultra-wideband microwave low noise amplifier series. LC4 refers to 24-pin leadless ceramic surface mount package with exposed thermal pad. TR represents tape-and-reel reel packaging for automated SMT mass production placement.
Core Electrical Performance Parameters
Working frequency range covers 6GHz ~ 26.5GHz, typical small signal gain reaches 22dB, gain fluctuation per degree Celsius is only 0.03dB, maintaining stable amplification effect under varying temperature conditions. Typical noise figure is 2.5dB, which effectively minimizes signal noise introduced during amplification and improves receiving signal sensitivity.
Single 3.5V power supply design, quiescent operating current 45mA, total power consumption controlled at 520mW. Output 1dB compression power is 10dBm, output third-order interception point up to 18dBm, possessing excellent linearity to avoid signal distortion under large dynamic range input signals.
Input and output ports are internally pre-matched to standard 50 ohm impedance with built-in DC blocking structure, no extra peripheral matching circuits needed. The chip adopts self-bias architecture without complex peripheral bias circuit configuration, simplifying RF front-end layout greatly.
Packaging and Assembly Specifications
Package adopts 24-pin leadless LCC ceramic encapsulation, overall size 4mm×4mm, bottom integrated exposed metal pad for efficient heat dissipation during continuous operation. It belongs to MSL3 moisture sensitive component, reflow soldering work must be completed within 168 hours after opening original vacuum packaging. Standard reel packaging is configured to match fully automatic placement equipment feeding requirements.
Environmental and Compliance Standards
Continuous operating temperature range is -40℃ ~ +85℃, adaptable to outdoor communication equipment, industrial testing instruments and airborne electronic systems with harsh temperature environments. The whole product adopts lead-free manufacturing process and complies with universal international environmental material restriction norms. Miniaturized packaging greatly saves the layout space of radio frequency receiving front-end boards.
Typical Application Fields
Point-to-point microwave communication radio equipment and point-to-multipoint broadband wireless access terminals
VSAT satellite receiving station front-end signal amplification unit and satellite communication RF receiving module
Microwave signal source, spectrum analyzer and other precision RF test instrument internal amplifying circuit
Aerospace airborne communication equipment, military microwave receiving front-end system
Millimeter wave radar sensing module and high-frequency local oscillator driving circuit for frequency mixing chips
LXB Semicon supplies original Analog Devices HMC963LC4TR broadband microwave low noise amplifier IC
