| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ADSP-TS203SABP-050 | ADSP-TS203S (TigerSHARC-S) | 0,00 | 500,00 | N/A | 4 Mbit on-chip DRAM | 0 | VDD_CORE ~1.05 V; VDD_IO ≈2.5 V; VDD_DRAM ~1.5 V (per variant) | Surface mount | −40 °C to +85 °C | 576-ball BGA | 576-BGA-ED |
ADSP-TS203SABP-050
Manufacturer: Analog Devices
Logic Cells: бк
Logic Slices: бк
Embedded RAM (eRAM): 24 Mbits On-Chip SRAM
Package: SABP
Operating Temperature: ?40°C to +85°C
Specifications
Part Number Definition
ADSP-TS203SABP-050 is a high-performance floating-point digital signal processor belonging to ADI TigerSHARC series. AB stands for standard industrial temperature grade specification, BP refers to thermally enhanced 576-ball BGA package sized 25mm×25mm; the suffix 050 denotes 500MHz core operating frequency. The device is originally supplied in tray packaging, and the product has been officially discontinued by the manufacturer.
Core Electrical Performance Parameters
This static superscalar architecture DSP is designed for intensive real-time signal computing scenarios, supporting both fixed-point and IEEE standard floating-point arithmetic operations simultaneously.
- Core Computing Specifications
- Operating clock frequency: 500MHz, single instruction cycle time 2ns
- Dual independent computing blocks are integrated inside the chip, each equipped with arithmetic logic unit, hardware multiplier, barrel shifter and dedicated register file; dual integer address calculation units are arranged separately to accelerate pointer addressing operations
- Compatible data formats: 8/16/32/64-bit fixed-point, 32-bit single-precision floating point, 40-bit extended precision floating point, capable of SIMD parallel execution to boost algorithm throughput
- On-chip Memory Configuration
- Embedded total 4Mbit on-chip DRAM memory, divided into four independently configurable memory banks, which can be flexibly allocated as program storage space and data buffer space
- Peak internal memory access bandwidth reaches 32GB/s via four groups of 128-bit internal data buses
- Peripheral & Transmission Resources
- 10-channel zero-overhead DMA controller, realizing automatic data transmission between internal memory, external memory, peripherals and multi-DSP nodes without occupying core computing resources
- Two high-speed Link Ports for point-to-point interconnection between multiple processors, supporting seamless glueless multi-chip cascading
- Built-in SDRAM memory controller, dual hardware timers, programmable general flag pins and standard JTAG debugging interface compliant with IEEE 1149.1 protocol
- Power Supply Conditions
- Core operating voltage: 1.05V
- I/O interface voltage: 2.5V
- No on-chip non-volatile flash memory, program firmware needs to be loaded from external storage devices after power-on
Packaging and Assembly Specifications
Encapsulated in 576-ball thermally enhanced BGA surface mount package with overall dimensions 25mm × 25mm. The bottom exposed thermal pad greatly improves heat dissipation efficiency under long-term full-load high-speed operation, and optimizes grounding stability for high-frequency digital circuits. Moisture Sensitivity Level is MSL3, all reflow soldering operations must be finished within 168 hours after vacuum packaging is opened. The original packing form is anti-static tray, suitable for industrial large-scale PCB assembly production.
Environmental and Compliance Standards
Continuous stable operating temperature range covers -40°C to +85°C, adapting to airborne equipment, ground radar stations, medical imaging equipment and industrial electronic systems with severe temperature fluctuation and complex electromagnetic interference environments. Manufactured with lead-free semiconductor fabrication processes, the component complies with global RoHS environmental directives. Although production has been stopped, its mature computing architecture and reliable long-term field verification still make it widely used for maintenance and upgrade of legacy professional signal processing equipment.
Typical Application Fields
Radar signal processing, beamforming and target echo detection systems
Medical CT, ultrasound and nuclear magnetic resonance imaging real-time data calculation units
Sonar underwater acoustic signal acquisition and post-processing equipment
Communication base station large-capacity channel equalization, demodulation and decoding modules
Aerospace airborne navigation, remote sensing data processing embedded systems
High-end spectrum analyzers, vector signal generators and professional test measurement instruments
