| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ADSP-TS201SABPZ-060 | ADSP-TS201S (TigerSHARC-R) | 0,00 | 600,00 | N/A | 2400000(≈3 MB) | 0 | VDD_CORE 1.20 V; VDD_IO 2.5 V; VDD_DRAM ≈1.6 V | Surface mount (BGA) | −40 °C to +85 °C | 576-ball BGA | 576-BGA-ED (25×25) (BP-576) |
ADSP-TS201SABPZ-060
Manufacturer: Analog Devices
Logic Cells: бк
Logic Slices: бк
Embedded RAM (eRAM): 24 Mbits On-Chip SRAM
Package: SABP
Operating Temperature: ?40°C to +85°C
Specifications
Part Number Definition
ADSP-TS201S is a high-performance floating-point DSP built on TigerSHARC static superscalar architecture, mainly used for massive real-time signal processing and multi-DSP parallel array systems.
Suffix code breakdown:
AB: Industrial temperature grade
BP: Thermally enhanced 576-ball BGA package, dimension 25mm × 25mm
Z: Fully lead-free, RoHS compliant packaging
-060: Nominal core operating frequency of 600MHz
Components are packed in anti-static trays for automated PCB surface mount assembly. This product line has been officially discontinued by the manufacturer.
Core Electrical Performance Parameters
Computing Core Architecture
This processor adopts dual independent arithmetic execution units with VLIW and SIMD parallel computing capabilities. Each arithmetic block integrates ALU, dedicated hardware multiplier and barrel shifter, paired with dual address generators to accelerate circular addressing and bit-reversal addressing required for FFT algorithms.
It supports multiple data formats: 8/16/32/64-bit fixed-point, 32-bit single-precision floating point and 40-bit extended precision floating point.
At 600MHz operating clock, the single instruction cycle is 1.67ns, peak floating-point computing performance reaches 3.6 GFLOPS, which can complete complex Fourier transform, digital filtering and other intensive computing tasks efficiently.
On-Chip Memory Resources
Total on-chip embedded DRAM capacity is 24Mbit, divided into multiple independent memory banks that can be flexibly allocated to program storage area and data buffer area. Ultra-wide internal buses provide extremely high data access bandwidth to eliminate data transmission bottlenecks during continuous algorithm operation. No built-in non-volatile flash memory is available; application firmware must be loaded from external storage after power-on initialization.
Integrated Peripheral Interfaces
- Four high-speed Link Ports: Support direct chip-to-chip interconnection without auxiliary logic circuits, easy to build scalable multi-processor parallel computing arrays
- 14-channel zero-overhead DMA controller: Automatically completes data transmission between internal memory, external SDRAM, peripherals and inter-chip ports without occupying core computing resources
- On-chip SDRAM controller for expanding large-capacity external memory space
- Dual programmable hardware timers, universal flag input and output pins
- Dedicated host interface for data interaction with upper master control chips
- IEEE 1149.1 standard JTAG debug interface for program downloading, online emulation and system fault troubleshooting
Power Supply Specifications
Core digital operating voltage: 1.2V
Digital I/O interface supply voltage: 2.5V
Packaging and Assembly Specifications
Adopts 576-ball thermally enhanced BGA surface mount package with overall size 25mm × 25mm. The large thermal pad on the bottom greatly improves heat dissipation efficiency under long-term full-load high-speed operation and optimizes grounding stability for high-speed digital circuits.
Moisture Sensitivity Level: MSL3. All reflow soldering operations must be finished within 168 hours after breaking the seal of vacuum packaging. Anti-static tray packaging is adopted to meet the batch production demands of industrial electronic equipment.
Environmental and Compliance Standards
Stable continuous operation is guaranteed within the temperature range of -40°C to +85°C, adapting to airborne electronic devices, ground radar stations, medical imaging systems and underwater acoustic equipment with drastic temperature fluctuations and strong electromagnetic interference.
Manufactured with full lead-free semiconductor processes, fully compliant with global RoHS environmental directives.
Typical Application Fields
Radar echo processing, beam forming and moving target detection tracking systems
Medical CT, MRI and ultrasound imaging real-time data calculation modules
Underwater sonar acoustic signal collection, filtering and post-processing equipment
Communication base station baseband demodulation, channel equalization and decoding units
Aerospace airborne navigation and remote sensing data embedded processing platforms
High-end spectrum analyzers, vector signal generators and precision electronic measuring instruments
