XC7Z035-L2FFG676E

제조업체: 자일링스
로직 셀: ~28,000(저전력 버전)
임베디드 RAM(eRAM): ~1.0 Mb
I/O 수: ~676핀
패키지: FFG?676
작동 온도: 상업용(0°C ~ +85°C)

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    사양

    모델 P/N 시리즈 실험실/CLBS 수 속도 등급 논리 요소/셀 수 총 램 비트 I/O 수 전압 - 공급 마운팅 유형 작동 온도 패키지 / 케이스 공급업체 디바이스 패키지
    XC7Z035-L2FFG676E Zynq-7000 SoC 42,98 0,00 275,000 LE 17600000 0 1.0 V SMD/SMT 확장(0°C ... 100°C) FCBGA-676 FCBGA-676

    부품 번호 분석

    This is Xilinx Zynq-7000 AP SoC built on 28nm process, combining dual-core Cortex-A9 processing system and large-scale Artix-7 programmable logic, optimized for low-power wide-temperature embedded industrial applications.
    1. XC7Z035: High-end large logic capacity model of Zynq-7000 family
    2. L2: Low-power speed grade 2, supports reduced core voltage operation to cut static and dynamic power consumption while retaining moderate timing performance
    3. FFG676: 676-ball flip-chip FCBGA compact package
    4. E: Extended industrial temperature grade, junction temperature range: -40°C ~ +125°C

    On-Chip Complete Hardware Architecture

    1. Processing System (PS: ARM Subsystem)

    • Dual-core ARM Cortex-A9 MPCore, maximum clock speed up to 1000MHz
    • Each core has 32KB I-cache + 32KB D-cache; 512KB shared L2 cache
    • Integrated NEON floating-point & SIMD engine for multimedia, signal computation acceleration
    • Standard onboard peripherals: Dual Gigabit Ethernet, USB2.0 OTG, SD/MMC, CAN, UART, SPI, I2C, GPIO
    • Secure boot supported for system startup security protection

    2. Programmable Logic (PL: Artix-7 FPGA Fabric)

    • Total Logic Cells: 277760
    • DSP48E1 arithmetic blocks: 900 units, used for digital filtering, FFT, multi-channel image processing and matrix calculation
    • Total Block RAM: 17.0 Mb
    • Multiple MMCM+PLL clock management tiles for multi-clock generation and jitter suppression
    • No embedded high-speed serial transceivers

    3. I/O & Analog Monitoring Module

    • Available user I/O pins: 360
    • Configurable I/O bank voltage 1.2V~3.3V, compatible with LVCMOS, LVDS and mainstream differential signal standards
    • On-chip dual-channel 12-bit XADC: real-time monitoring of die temperature, internal supply voltages and external analog signals

    전원 공급 장치 사양

    Standard core voltage: 1.0V

    Low-power mode core voltage can be lowered to reduce power draw under light workloads

    Separate power domains for PS and PL sections

    Typical total power consumption: 9W ~ 28W; passive heat sinks work for compact low-power embedded devices

    포장 및 SMT 조립 요건

    • Package: 676-pin FCBGA flip-chip ball grid array
    • Moisture Sensitivity Level: MSL3; reflow soldering must be completed within 168 hours after vacuum bag opening
    • Lead-free construction, RoHS compliant
    • Supplied in anti-static trays for automated PCB mass production

    Reliability & Environmental Performance

    Stable continuous operation under extreme temperature swings and strong electromagnetic interference industrial environments.

    Supports bitstream encryption and SEU error checking, designed for outdoor industrial equipment, vehicle-mounted systems and airborne lightweight electronic devices requiring wide temperature adaptability.

    일반적인 애플리케이션 시나리오

    1. Outdoor industrial motion controllers, field equipment edge control gateways
    2. Rugged portable machine vision inspection terminals for field operation
    3. Vehicle-mounted multi-channel data recording and automotive perception preprocessing units
    4. Handheld high-precision measuring instruments and vibration monitoring acquisition equipment
    5. Miniature airborne signal preprocessing and short-range radar peripheral control boards
    6. Wide-temperature industrial SOM core modules and rugged embedded secondary development platforms