| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z100-L2FFG900E | Zynq-7000 | 26.150,00 | -2,00 | 277,400 | 26200000 | 250 | 0,95 V (bajo consumo) | Montaje en superficie | Ampliado (0 °C ~ 100 °C) | BGA-900 | 900-FCBGA (31 × 31 mm) |
XC7Z100-L2FFG900E
Fabricante: Xilinx
Células lógicas: ~101 000 (versión de bajo consumo)
RAM integrada (eRAM): ~4,9 MB
Recuento de E/S: ~900 pines
Paquete: FFG?900
Temperatura de funcionamiento: Comercial (0°C a +85°C)
Especificaciones
Part Number Detailed Definition
This is a low-power wide-temperature flagship heterogeneous all-programmable SoC from AMD Xilinx Zynq-7000 series, fabricated on 28nm process technology. It integrates dual-core ARM Cortex-A9 processing subsystem and full-capacity Kintex-7 maximum FPGA programmable logic, optimized for low power consumption, compact size and wide-temperature harsh industrial, vehicular and portable airborne embedded computing scenarios.
- XC7Z100: Top flagship model of the entire Zynq-7000 product line, equipped with the largest Kintex-7 FPGA resource configuration
- L2: Low-power optimized speed grade 2; core supply voltage is reduced to lower static and dynamic power consumption significantly, CPU maximum operating frequency is limited to 800MHz to guarantee stable timing performance across wide temperature range
- FFG900: 900-ball flip-chip FCBGA compact package, overall dimension 31mm × 31mm, ball pitch 1.0mm, smaller footprint than FFG1156 version for equipment miniaturization design
- E: Extended industrial temperature grade, junction temperature operating range: 0 °C ~ +100 °C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore processor with CoreSight debug architecture, maximum stable frequency 800MHz under low-power wide-temperature configuration
- Each core: independent 32KB instruction L1 cache + 32KB data L1 cache; shared 1MB L2 cache
- Integrated NEON SIMD floating-point arithmetic unit and FPU, for large-scale signal algorithm calculation, multimedia encoding/decoding acceleration
- On-chip 256KB OCM high-speed on-chip memory; supports DDR2/DDR3L low-power external memory expansion
- Full peripheral controllers: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC, dual CAN 2.0B, UART, SPI, I2C, multi-function MIO GPIO, 8-channel DMA controller
- 256-bit AES secure boot + SHA-256 firmware integrity verification, preventing program tampering for industrial system security
2. Programmable Logic (PL: Kintex-7 Top-Tier FPGA Fabric)
- Total Logic Cells: 444,000
- DSP48E1 dedicated arithmetic slices: 2020 units, applicable to massive FFT calculation, digital filtering, wireless baseband signal processing, multi-channel HD video algorithm acceleration and large matrix computing tasks
- Total Block RAM capacity: 26.5 Mb
- Multiple MMCM & PLL clock management tiles, supporting multi-domain clock generation and high-frequency clock jitter suppression
- 16-channel GTX high-speed serial transceivers, maximum line rate up to 12.5Gbps, compatible with PCIe Gen2, 10G Ethernet, CPRI, JESD204B, Aurora serial communication protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user PL I/O pins: 400
- I/O bank voltage adjustable between 1.2V and 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards
- Dual-channel 12-bit XADC analog monitor integrated on chip: Real-time continuous monitoring of die junction temperature, all internal power supply voltages and external analog input signals
Power Supply Specifications
- Standard core nominal voltage: 1.0V
- Low-power operating voltage: Reduced voltage scheme enabled for L2 grade, cutting overall power consumption under light and medium loads
- Independent isolated power domains assigned for PS processor section and PL FPGA logic section separately
- Typical total power consumption: 13W ~ 34W; passive heat dissipation or compact small fan heatsink can meet long-term full-load stable operation requirements
Packaging & SMT Assembly Requirements
- Package type: 900-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be finished within 72 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
Environmental Adaptability & Reliability
It can operate stably continuously under temperature fluctuation, slight vibration and moderate electromagnetic interference industrial environments.
Supports AES bitstream encryption protection and SEU single-event upset error detection, with enhanced thermal robustness and lower power consumption, ideal for miniaturized rugged devices requiring wide-temperature working conditions.
Escenarios típicos de aplicación
- Miniaturized software-defined radio baseband platforms, portable wireless communication test instruments
- Vehicular multi-sensor fusion computing main control units, automotive intelligent video processing terminals
- Handheld high-end oscilloscopes, portable spectrum analyzers and multi-channel high-speed data recorders
- Outdoor compact edge computing gateways for multi-channel video surveillance
- Lightweight airborne radar signal preprocessing and data forwarding modules
- Low-power extended-temperature industrial high-performance SOM core modules and battery-powered embedded algorithm verification platforms
