| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z100-L2FLG900E | Zynq-7000 | 26.150,00 | -2,00 | 277,400 | 26200000 | 250 | 0.95 فولت (طاقة منخفضة) | التركيب على السطح | ممتد (0 درجة مئوية إلى 100 درجة مئوية) | BGA-900 | 900-FCBGA (31×31 مم) |
XC7Z100-L2FLG900E
الشركة المصنعة: زيلينكس
الخلايا المنطقية: حوالي 101,000 (الإصدار منخفض الطاقة)
ذاكرة الوصول العشوائي المدمجة (eRAM): حوالي 4.9 ميغابايت
عدد الإدخال/الإخراج: حوالي 900 دبوس
الحزمة: FFG-900
درجة حرارة التشغيل: تجاري (0 درجة مئوية إلى +85 درجة مئوية)
المواصفات
Part Number Detailed Definition
This is a low-power wide-temperature flagship heterogeneous all-programmable SoC from AMD Xilinx Zynq-7000 series, fabricated on 28nm process technology. It integrates dual-core ARM Cortex-A9 processing subsystem and full-capacity Kintex-7 maximum FPGA programmable logic, optimized for low power consumption, compact size and wide-temperature harsh industrial, vehicular and portable airborne embedded computing scenarios.
- XC7Z100: Top flagship model of the entire Zynq-7000 product line, equipped with the largest Kintex-7 FPGA resource configuration
- L2: Low-power optimized speed grade 2; core supply voltage is reduced to lower static and dynamic power consumption significantly, CPU maximum operating frequency is limited to 800MHz to guarantee stable timing performance across wide temperature range
- FFG900: 900-ball flip-chip FCBGA compact package, overall dimension 31mm × 31mm, ball pitch 1.0mm, smaller footprint than FFG1156 version for equipment miniaturization design
- E: Extended industrial temperature grade, junction temperature operating range: 0 درجة مئوية ~ +100 درجة مئوية
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore processor with CoreSight debug architecture, maximum stable frequency 800MHz under low-power wide-temperature configuration
- Each core: independent 32KB instruction L1 cache + 32KB data L1 cache; shared 1MB L2 cache
- Integrated NEON SIMD floating-point arithmetic unit and FPU, for large-scale signal algorithm calculation, multimedia encoding/decoding acceleration
- On-chip 256KB OCM high-speed on-chip memory; supports DDR2/DDR3L low-power external memory expansion
- Full peripheral controllers: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC, dual CAN 2.0B, UART, SPI, I2C, multi-function MIO GPIO, 8-channel DMA controller
- 256-bit AES secure boot + SHA-256 firmware integrity verification, preventing program tampering for industrial system security
2. Programmable Logic (PL: Kintex-7 Top-Tier FPGA Fabric)
- Total Logic Cells: 444,000
- DSP48E1 dedicated arithmetic slices: 2020 units, applicable to massive FFT calculation, digital filtering, wireless baseband signal processing, multi-channel HD video algorithm acceleration and large matrix computing tasks
- Total Block RAM capacity: 26.5 Mb
- Multiple MMCM & PLL clock management tiles, supporting multi-domain clock generation and high-frequency clock jitter suppression
- 16-channel GTX high-speed serial transceivers, maximum line rate up to 12.5Gbps, compatible with PCIe Gen2, 10G Ethernet, CPRI, JESD204B, Aurora serial communication protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user PL I/O pins: 400
- I/O bank voltage adjustable between 1.2V and 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards
- Dual-channel 12-bit XADC analog monitor integrated on chip: Real-time continuous monitoring of die junction temperature, all internal power supply voltages and external analog input signals
مواصفات مصدر الطاقة
- Standard core nominal voltage: 1.0V
- Low-power operating voltage: Reduced voltage scheme enabled for L2 grade, cutting overall power consumption under light and medium loads
- Independent isolated power domains assigned for PS processor section and PL FPGA logic section separately
- Typical total power consumption: 13W ~ 34W; passive heat dissipation or compact small fan heatsink can meet long-term full-load stable operation requirements
متطلبات التغليف وتجميع المكونات الإلكترونية (SMT)
- Package type: 900-pin flip-chip FCBGA ball grid array
- مستوى الحساسية للرطوبة: MSL4؛ يجب إنهاء جميع عمليات اللحام بإعادة التدفق في غضون 72 ساعة بعد فتح العبوة المفرغة من الهواء
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
القدرة على التكيف مع البيئة والموثوقية
It can operate stably continuously under temperature fluctuation, slight vibration and moderate electromagnetic interference industrial environments.
Supports AES bitstream encryption protection and SEU single-event upset error detection, with enhanced thermal robustness and lower power consumption, ideal for miniaturized rugged devices requiring wide-temperature working conditions.
سيناريوهات التطبيق النموذجية
- Miniaturized software-defined radio baseband platforms, portable wireless communication test instruments
- Vehicular multi-sensor fusion computing main control units, automotive intelligent video processing terminals
- Handheld high-end oscilloscopes, portable spectrum analyzers and multi-channel high-speed data recorders
- Outdoor compact edge computing gateways for multi-channel video surveillance
- Lightweight airborne radar signal preprocessing and data forwarding modules
- Low-power extended-temperature industrial high-performance SOM core modules and battery-powered embedded algorithm verification platforms
