| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z100-2FFG900E | Zynq-7000 | 26.150,00 | -2,00 | 277,400 | 26200000 | 250 | 1,0 V | Montaje en superficie | Ampliado (0 °C ~ 100 °C) | BGA-900 | 900-FCBGA (31 × 31 mm) |
XC7Z100-2FFG900E
Fabricante: Xilinx
Células lógicas: ~101,000
RAM integrada (eRAM): ~4,9 MB
Recuento de E/S: ~900 pines
Paquete: FFG?900
Temperatura de funcionamiento: Comercial (0°C a +85°C)
Especificaciones
Definición del número de pieza
This flagship extended-temperature heterogeneous all-programmable SoC belongs to AMD Xilinx Zynq-7000 family, fabricated on mature 28nm process technology. It integrates dual-core ARM Cortex-A9 processing subsystem and maximum-capacity Kintex-7 FPGA logic resources, designed for high-performance signal processing, multi-channel video computing and rugged embedded devices requiring wide-temperature stable operation.
- XC7Z100: Top flagship model of Zynq-7000 series, equipped with the largest FPGA resource configuration across the entire product lineup
- -2: Speed Grade 2, mainstream balanced timing grade. It delivers sufficient timing margin for complex high-frequency digital logic designs, striking a balance between maximum operating frequency, timing stability and overall power consumption
- FFG900: 900-ball flip-chip FCBGA compact package, body dimension 31mm × 31mm, ball pitch 1.0mm, smaller footprint than 1156-ball version for equipment miniaturization layout
- E: Extended industrial temperature grade, operating junction temperature range: 0 °C ~ +100 °C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore processor, peak frequency up to 1000MHz; stable working frequency 800MHz under full wide-temperature range operation
- Each core owns independent 32KB instruction L1 cache and 32KB data L1 cache; shared 1MB L2 cache
- Embedded NEON SIMD floating-point arithmetic unit and hardware FPU, accelerating digital signal algorithms, multimedia encoding and decoding tasks
- 256KB on-chip OCM high-speed memory integrated inside chip; supports external DDR3/DDR3L low-power memory expansion
- Full set of standard peripheral controllers: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC interface, dual CAN 2.0B, UART, SPI, I2C, multi-function MIO GPIO
- Supports 256-bit AES secure boot and SHA-256 firmware integrity verification to prevent program tampering and ensure industrial system security
2. Programmable Logic (PL: Kintex-7 High-End FPGA Fabric)
- Total Logic Cells: 444,000
- DSP48E1 dedicated arithmetic slices: 2020 units, applicable to massive FFT computation, digital filtering, wireless baseband processing, multi-channel HD/4K image algorithm acceleration and large-scale matrix calculation
- Total Block RAM capacity: 26.5 Mb
- Multiple MMCM and PLL clock management modules for multi-domain clock generation and high-frequency clock jitter suppression
- 16 GTX high-speed serial transceivers, maximum line rate up to 12.5Gbps, compatible with PCIe Gen2, 10G Ethernet, CPRI, JESD204B, Aurora mainstream high-speed serial communication protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user PL I/O pins: 362
- I/O bank voltage adjustable from 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
- Dual-channel 12-bit XADC analog monitor integrated on chip: Real-time continuous monitoring of die junction temperature, all internal power supply voltages and external analog input signals
Power Supply Specifications
- Nominal core internal voltage (VCCINT): 1.0V
- Independent isolated power domains are allocated separately for PS processor area and PL FPGA logic area
- Typical overall power consumption: 15W ~ 38W; active cooling heatsink is required for long-term stable full-load operation under high-temperature conditions
Packaging & SMT Assembly Requirements
- Package: 900-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be completed within 72 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
Environmental Adaptability & Reliability
The chip can run continuously and stably under temperature fluctuation, slight vibration and moderate electromagnetic interference industrial environments.
It supports AES bitstream encryption protection and SEU single-event upset error detection, with optimized thermal design to adapt to extended temperature scenarios, widely adopted in rugged industrial, communication and portable test instruments.
Escenarios típicos de aplicación
- Miniaturized software-defined radio baseband platforms, wireless communication field test instruments
- Outdoor multi-channel video surveillance edge computing gateways, intelligent image processing terminals
- Portable high-end oscilloscopes, spectrum analyzers and multi-channel high-speed data acquisition recorders
- Vehicular multi-sensor fusion main control units, automotive intelligent computing terminals
- Lightweight airborne radar signal preprocessing and data forwarding modules
- Extended-temperature industrial high-performance SOM core modules and complex embedded algorithm verification platforms
