| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc7z100-2ffg900e | Zynq-7000 | 26.150,00 | -2,00 | 277,400 | 26200000 | 250 | 1.0 V | التركيب على السطح | ممتد (0 درجة مئوية إلى 100 درجة مئوية) | BGA-900 | 900-FCBGA (31×31 مم) |
xc7z100-2ffg900e
الشركة المصنعة: زيلينكس
الخلايا المنطقية: ~101,000
ذاكرة الوصول العشوائي المدمجة (eRAM): حوالي 4.9 ميغابايت
عدد الإدخال/الإخراج: حوالي 900 دبوس
الحزمة: FFG-900
درجة حرارة التشغيل: تجاري (0 درجة مئوية إلى +85 درجة مئوية)
المواصفات
تعريف رقم القطعة
This flagship extended-temperature heterogeneous all-programmable SoC belongs to AMD Xilinx Zynq-7000 family, fabricated on mature 28nm process technology. It integrates dual-core ARM Cortex-A9 processing subsystem and maximum-capacity Kintex-7 FPGA logic resources, designed for high-performance signal processing, multi-channel video computing and rugged embedded devices requiring wide-temperature stable operation.
- XC7Z100: Top flagship model of Zynq-7000 series, equipped with the largest FPGA resource configuration across the entire product lineup
- -2: Speed Grade 2, mainstream balanced timing grade. It delivers sufficient timing margin for complex high-frequency digital logic designs, striking a balance between maximum operating frequency, timing stability and overall power consumption
- FFG900: 900-ball flip-chip FCBGA compact package, body dimension 31mm × 31mm, ball pitch 1.0mm, smaller footprint than 1156-ball version for equipment miniaturization layout
- E: Extended industrial temperature grade, operating junction temperature range: 0 درجة مئوية ~ +100 درجة مئوية
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore processor, peak frequency up to 1000MHz; stable working frequency 800MHz under full wide-temperature range operation
- Each core owns independent 32KB instruction L1 cache and 32KB data L1 cache; shared 1MB L2 cache
- Embedded NEON SIMD floating-point arithmetic unit and hardware FPU, accelerating digital signal algorithms, multimedia encoding and decoding tasks
- 256KB on-chip OCM high-speed memory integrated inside chip; supports external DDR3/DDR3L low-power memory expansion
- Full set of standard peripheral controllers: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC interface, dual CAN 2.0B, UART, SPI, I2C, multi-function MIO GPIO
- Supports 256-bit AES secure boot and SHA-256 firmware integrity verification to prevent program tampering and ensure industrial system security
2. Programmable Logic (PL: Kintex-7 High-End FPGA Fabric)
- Total Logic Cells: 444,000
- DSP48E1 dedicated arithmetic slices: 2020 units, applicable to massive FFT computation, digital filtering, wireless baseband processing, multi-channel HD/4K image algorithm acceleration and large-scale matrix calculation
- Total Block RAM capacity: 26.5 Mb
- Multiple MMCM and PLL clock management modules for multi-domain clock generation and high-frequency clock jitter suppression
- 16 GTX high-speed serial transceivers, maximum line rate up to 12.5Gbps, compatible with PCIe Gen2, 10G Ethernet, CPRI, JESD204B, Aurora mainstream high-speed serial communication protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user PL I/O pins: 362
- I/O bank voltage adjustable from 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
- Dual-channel 12-bit XADC analog monitor integrated on chip: Real-time continuous monitoring of die junction temperature, all internal power supply voltages and external analog input signals
مواصفات مصدر الطاقة
- Nominal core internal voltage (VCCINT): 1.0V
- Independent isolated power domains are allocated separately for PS processor area and PL FPGA logic area
- Typical overall power consumption: 15W ~ 38W; active cooling heatsink is required for long-term stable full-load operation under high-temperature conditions
متطلبات التغليف وتجميع المكونات الإلكترونية (SMT)
- Package: 900-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be completed within 72 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
القدرة على التكيف مع البيئة والموثوقية
The chip can run continuously and stably under temperature fluctuation, slight vibration and moderate electromagnetic interference industrial environments.
It supports AES bitstream encryption protection and SEU single-event upset error detection, with optimized thermal design to adapt to extended temperature scenarios, widely adopted in rugged industrial, communication and portable test instruments.
سيناريوهات التطبيق النموذجية
- Miniaturized software-defined radio baseband platforms, wireless communication field test instruments
- Outdoor multi-channel video surveillance edge computing gateways, intelligent image processing terminals
- Portable high-end oscilloscopes, spectrum analyzers and multi-channel high-speed data acquisition recorders
- Vehicular multi-sensor fusion main control units, automotive intelligent computing terminals
- Lightweight airborne radar signal preprocessing and data forwarding modules
- Extended-temperature industrial high-performance SOM core modules and complex embedded algorithm verification platforms
