| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z030-L2FFG676E | SoC Zynq-7000 | 9.825,00 | -2,00 | 125,000 | 9768960 | 228 | ~0,95–1,0 V | Montaje en superficie | 0 °C ~ +100 °C | FCBGA-676 | 676-FCBGA (27 × 27 mm) |
XC7Z030-L2FFG676E
Fabricante: Xilinx
Células lógicas: ~27,600 (Low Power Version)
RAM integrada (eRAM): ~1,0 MB
Recuento de E/S: ~676 pines
Paquete: FFG?676
Temperatura de funcionamiento: Comercial (0°C a +85°C)
Especificaciones
Definición del número de pieza
This is Xilinx Zynq-7000 low-power wide-temperature heterogeneous all-programmable SoC built on 28nm process node, integrating dual-core ARM Cortex-A9 processing subsystem and mid-capacity Artix-7 programmable logic, optimized for low power consumption and harsh wide-temperature industrial, vehicular and portable field devices.
- XC7Z030: Mid-range mainstream model of Zynq-7000 series
- L2: Low-power optimized speed grade 2 (2LI); supports reduced core voltage operation (0.95V) to greatly cut static and dynamic power consumption while retaining stable timing performance, prioritizing energy efficiency over peak operating frequency
- FFG676: 676-ball flip-chip FCBGA compact package
- E: Extended industrial temperature grade, junction temperature operating range: -40°C ~ +125°C
Complete On-Chip Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore, maximum operating frequency up to 800MHz under low-power mode
- Each core: 32KB instruction cache + 32KB data cache; 512KB shared L2 cache
- Integrated NEON SIMD floating-point arithmetic unit for multimedia decoding and basic digital signal algorithm acceleration
- Standard onboard peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC controller, CAN bus, UART, SPI, I2C, general GPIO
- Secure boot with AES/SHA256 encryption supported to prevent firmware tampering and guarantee system security
2. Programmable Logic (PL: Artix-7 FPGA Fabric)
- Total Logic Cells: 125,440
- DSP48E1 dedicated arithmetic slices: 480 units, applied for small-scale FFT, digital filtering, single-channel image preprocessing and simple matrix calculation tasks
- Total Block RAM capacity: 9.1 Mb
- Multiple MMCM and PLL clock management tiles for multi-group clock generation and clock jitter suppression
- No embedded high-speed serial transceivers inside the chip
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user I/O pins: 360
- I/O bank voltage configurable from 1.2V to 3.3V, compatible with LVCMOS, LVDS and all mainstream differential signal standards
- On-chip dual-channel 12-bit XADC analog monitor: Real-time sampling of chip internal junction temperature, each group power supply voltage and external analog input signals
Power Supply Specifications
- Standard core voltage: 1.0V
- Low-power operating core voltage: 0.95V, significantly reduces overall power draw under light and medium workloads
- Independent isolated power domains allocated for PS processor section and PL programmable logic section
- Typical total power consumption: 5W ~ 18W; passive heat dissipation can satisfy long-term stable operation for compact battery-powered embedded equipment
Packaging & SMT Assembly Requirements
- Package: 676-pin flip-chip FCBGA ball grid array, physical dimension 27mm × 27mm
- Moisture Sensitivity Level: MSL3; all reflow soldering procedures must be completed within 168 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS and REACH environmental directives
- Delivered in anti-static trays for automated PCB mass production
Environmental & Reliability Performance
Capable of continuous stable operation under drastic temperature fluctuations and strong electromagnetic interference harsh industrial environments.
It supports 256-bit AES bitstream encryption protection and SEU single-event upset error detection, designed for outdoor field industrial equipment, automotive electronic control systems, handheld portable measuring instruments and lightweight airborne embedded terminals requiring ultra-wide temperature adaptability and low power consumption.
Escenarios típicos de aplicación
- Outdoor rugged small industrial controllers, field environmental monitoring edge gateway terminals
- Vehicular multi-channel data recorders, in-vehicle auxiliary video preprocessing modules
- Handheld portable signal analyzers, field vibration and environmental parameter acquisition instruments
- Rugged portable single-camera industrial visual inspection equipment for field operation
- Miniature short-range radar peripheral control and signal preprocessing boards
- Wide-temperature industrial-grade low-power SOM core modules and battery-powered embedded algorithm verification platforms
