| MÃ SẢN PHẨM | BỘ PHIM | SỐ LƯỢNG PHÒNG THÍ NGHIỆM/CLBS | ĐỘ BỀN THEO TỐC ĐỘ | SỐ LƯỢNG PHẦN TỬ LỐI / TẾ BÀO | Tổng số bit RAM | SỐ LƯỢNG I/O | Điện áp – Nguồn cấp | Loại lắp đặt | NHIỆT ĐỘ HOẠT ĐỘNG | GÓI / HỘP | GÓI THIẾT BỊ CỦA NHÀ CUNG CẤP |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z030-L2FFG676E | Bộ xử lý hệ thống (SoC) Zynq-7000 | 9.825,00 | -2,00 | 125,000 | 9768960 | 228 | ~0,95–1,0 V | Lắp đặt bề mặt | 0 °C ~ +100 °C | FCBGA-676 | 676-FCBGA (27×27 mm) |
XC7Z030-L2FFG676E
Nhà sản xuất: Xilinx
Tế bào logic: ~27,600 (Low Power Version)
Bộ nhớ RAM tích hợp (eRAM): ~1,0 MB
Số lượng I/O: ~676 lượt ghim
Gói: FFG?676
Nhiệt độ hoạt động: Thương mại (0°C đến +85°C)
Thông số kỹ thuật
Định nghĩa mã sản phẩm
This is Xilinx Zynq-7000 low-power wide-temperature heterogeneous all-programmable SoC built on 28nm process node, integrating dual-core ARM Cortex-A9 processing subsystem and mid-capacity Artix-7 programmable logic, optimized for low power consumption and harsh wide-temperature industrial, vehicular and portable field devices.
- XC7Z030: Mid-range mainstream model of Zynq-7000 series
- L2: Low-power optimized speed grade 2 (2LI); supports reduced core voltage operation (0.95V) to greatly cut static and dynamic power consumption while retaining stable timing performance, prioritizing energy efficiency over peak operating frequency
- FFG676: Vỏ gói FCBGA nhỏ gọn với 676 bóng, công nghệ flip-chip
- E: Extended industrial temperature grade, junction temperature operating range: -40°C ~ +125°C
Complete On-Chip Hardware Architecture
1. Hệ thống xử lý (PS: Hệ thống con ARM)
- Dual-core ARM Cortex-A9 MPCore, maximum operating frequency up to 800MHz under low-power mode
- Each core: 32KB instruction cache + 32KB data cache; 512KB shared L2 cache
- Integrated NEON SIMD floating-point arithmetic unit for multimedia decoding and basic digital signal algorithm acceleration
- Standard onboard peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC controller, CAN bus, UART, SPI, I2C, general GPIO
- Secure boot with AES/SHA256 encryption supported to prevent firmware tampering and guarantee system security
2. Logic lập trình (PL: Cấu trúc FPGA Artix-7)
- Total Logic Cells: 125,440
- DSP48E1 dedicated arithmetic slices: 480 units, applied for small-scale FFT, digital filtering, single-channel image preprocessing and simple matrix calculation tasks
- Total Block RAM capacity: 9.1 Mb
- Multiple MMCM and PLL clock management tiles for multi-group clock generation and clock jitter suppression
- No embedded high-speed serial transceivers inside the chip
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user I/O pins: 360
- I/O bank voltage configurable from 1.2V to 3.3V, compatible with LVCMOS, LVDS and all mainstream differential signal standards
- On-chip dual-channel 12-bit XADC analog monitor: Real-time sampling of chip internal junction temperature, each group power supply voltage and external analog input signals
Thông số kỹ thuật bộ nguồn
- Điện áp lõi tiêu chuẩn: 1,0 V
- Low-power operating core voltage: 0.95V, significantly reduces overall power draw under light and medium workloads
- Independent isolated power domains allocated for PS processor section and PL programmable logic section
- Typical total power consumption: 5W ~ 18W; passive heat dissipation can satisfy long-term stable operation for compact battery-powered embedded equipment
Yêu cầu về đóng gói và lắp ráp SMT
- Package: 676-pin flip-chip FCBGA ball grid array, physical dimension 27mm × 27mm
- Moisture Sensitivity Level: MSL3; all reflow soldering procedures must be completed within 168 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS and REACH environmental directives
- Delivered in anti-static trays for automated PCB mass production
Hiệu suất về môi trường và độ tin cậy
Capable of continuous stable operation under drastic temperature fluctuations and strong electromagnetic interference harsh industrial environments.
It supports 256-bit AES bitstream encryption protection and SEU single-event upset error detection, designed for outdoor field industrial equipment, automotive electronic control systems, handheld portable measuring instruments and lightweight airborne embedded terminals requiring ultra-wide temperature adaptability and low power consumption.
Các tình huống ứng dụng điển hình
- Outdoor rugged small industrial controllers, field environmental monitoring edge gateway terminals
- Vehicular multi-channel data recorders, in-vehicle auxiliary video preprocessing modules
- Handheld portable signal analyzers, field vibration and environmental parameter acquisition instruments
- Rugged portable single-camera industrial visual inspection equipment for field operation
- Miniature short-range radar peripheral control and signal preprocessing boards
- Wide-temperature industrial-grade low-power SOM core modules and battery-powered embedded algorithm verification platforms
