| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K480T-2FFG1156E | Kintex-7 | 37.325,00 | -2,00 | 477,760 | 35205120 | 400 | 0,97 – 1,03 V (típico: 1,0 V) | Montaje en superficie | 0 °C — 100 °C | 1156-FCBGA | 1156-FCBGA (35 × 35 mm) |
XC7K480T-2FFG1156E
Fabricante: Xilinx
Células lógicas: 477,760
Rebanadas lógicas: 74,650
RAM integrada (eRAM): 33 840 Kb (940 × 36 Kb de RAM en bloques)
E/S máxima por usuario: 500
Paquete: FFG1156 (BGA con chip invertido)
Grado de velocidad: -2
Temperatura de funcionamiento: Ampliado (0 °C a +100 °C)
Especificaciones
Definición del número de pieza
This high-density extended industrial temperature FPGA belongs to Xilinx Kintex-7 family, fabricated on mature 28nm semiconductor process. It delivers abundant logic, DSP and storage resources together with massive high-speed serial interfaces, designed for complex signal processing, multi-channel high-speed data acquisition, industrial vision and rugged communication equipment requiring stable operation across wide industrial temperature range.
- XC7K480T: Top-tier high-capacity model of Kintex-7 series; suffix T refers to low-power optimized silicon variant
- -2: Speed Grade 2, mainstream balanced timing grade. It reserves sufficient timing margin for large-scale high-frequency digital logic design, balancing maximum operating frequency, timing closure stability and overall power consumption
- FFG1156: 1156-ball flip-chip FCBGA large package. Ample pins support extensive peripheral expansion, parallel multi-channel signal access and full utilization of on-board transceivers
- E: Extended industrial temperature specification, operating junction temperature range: -40°C ~ +100°C
On-Chip Hardware Resource Details
1. Recursos generales sobre lógica programable
- Total Logic Cells: 485760
- Configurable Slices: 75900
- Total Flip-Flops: 607200
- Total LUTs: 303600
2. Recursos aritméticos y de memoria integrada
- DSP48E1 arithmetic slices: 1920 units, ideal for large-scale FFT computation, digital filtering, radar signal demodulation, multi-channel high-definition video algorithm acceleration and large matrix operations
- Total Block RAM Capacity: 34290 Kb, used for image frame caching, deep FIFO data buffering, waveform storage and algorithm parameter lookup tables
- Distributed RAM Capacity: 8440 Kb
3. Clock Management Subsystem
- 12 bloques de gestión de reloj MMCM
- 12 circuitos de bucle de fase (PLL)
Supports multi-clock domain generation, phase adjustment, clock delay compensation and high-frequency jitter suppression, satisfying strict timing synchronization requirements of ultra-large complex embedded systems
4. Transceptores seriales de alta velocidad
- 20 transceptores diferenciales de alta velocidad GTX
Maximum line rate up to 10.3125 Gbps, compatible with PCIe Gen2, 10 Gigabit Ethernet, CPRI, JESD204B, Aurora mainstream serial communication protocols
5. Interfaces de E/S y módulo de monitoreo integrado en el chip
- Configurable user I/O pins: 560
I/O bank voltage adjustable from 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
Integrated dual-channel 12-bit XADC analog monitor to realize real-time continuous monitoring of die junction temperature, internal power supply voltages and external analog input signals
Especificaciones de la fuente de alimentación
Nominal core operating voltage: 1.0V
Logic fabric, Block RAM, DSP array and serial transceivers adopt independent isolated power domains separately
Typical overall power consumption: 13W ~ 38W; active forced-air cooling is required for stable continuous full-load operation under high-temperature limit conditions
Requisitos de empaque y ensamblaje SMT
- Package Type: 1156-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be completed within 72 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered and stored in anti-static trays to prevent electrostatic damage during automated PCB mass production
Adaptabilidad ambiental y confiabilidad
The chip maintains stable long-term operation under wide temperature fluctuation, mechanical vibration, shock and moderate electromagnetic interference harsh industrial environments. It supports 256-bit AES bitstream encryption and SEU single-event upset detection and correction, featuring excellent thermal robustness and anti-interference performance for field rugged devices.
Escenarios típicos de aplicación
- High-end portable spectrum analyzers, multi-channel high-speed oscilloscopes and transient signal recording instruments
- Software-defined radio baseband processing platforms, outdoor small cell wireless communication main control equipment
- Multi-channel industrial machine vision inspection systems, high-speed real-time image processing units
- Industrial high-performance convergence gateways, multi-protocol fieldbus integration equipment
- Lightweight airborne radar signal preprocessing modules, vehicle-mounted multi-sensor fusion computing hosts
- Extended-temperature industrial high-performance SOM core boards and ultra-complex embedded algorithm prototype verification platforms
