| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| xc7k480t-2ffg1156e | كينتكس-7 | 37.325,00 | -2,00 | 477,760 | 35205120 | 400 | 0.97 - 1.03 فولت (النوع 1.0 فولت) | التركيب على السطح | 0 درجة مئوية - 100 درجة مئوية | 1156-FCBGA | 1156-FCBGA (35 × 35 مم) |
xc7k480t-2ffg1156e
الشركة المصنعة: زيلينكس
الخلايا المنطقية: 477,760
شرائح المنطق: 74,650
ذاكرة الوصول العشوائي المدمجة (eRAM): 33,840 كيلوبايت (ذاكرة RAM مقسمة إلى كتل سعة كل منها 36 كيلوبايت، عدد الكتل 940)
الحد الأقصى لإدخال/إخراج المستخدم: 500
الحزمة: FFG1156 (Flip-Chip BGA)
درجة السرعة: -2
درجة حرارة التشغيل: ممتد (من 0 درجة مئوية إلى +100 درجة مئوية)
المواصفات
تعريف رقم القطعة
This high-density extended industrial temperature FPGA belongs to Xilinx Kintex-7 family, fabricated on mature 28nm semiconductor process. It delivers abundant logic, DSP and storage resources together with massive high-speed serial interfaces, designed for complex signal processing, multi-channel high-speed data acquisition, industrial vision and rugged communication equipment requiring stable operation across wide industrial temperature range.
- XC7K480T: Top-tier high-capacity model of Kintex-7 series; suffix T refers to low-power optimized silicon variant
- -2: Speed Grade 2, mainstream balanced timing grade. It reserves sufficient timing margin for large-scale high-frequency digital logic design, balancing maximum operating frequency, timing closure stability and overall power consumption
- FFG1156: 1156-ball flip-chip FCBGA large package. Ample pins support extensive peripheral expansion, parallel multi-channel signal access and full utilization of on-board transceivers
- E: Extended industrial temperature specification, operating junction temperature range: -40°C ~ +100°C
On-Chip Hardware Resource Details
1. الموارد العامة للمنطق القابل للبرمجة
- Total Logic Cells: 485760
- Configurable Slices: 75900
- Total Flip-Flops: 607200
- Total LUTs: 303600
2. موارد الحساب والذاكرة المدمجة
- DSP48E1 arithmetic slices: 1920 units, ideal for large-scale FFT computation, digital filtering, radar signal demodulation, multi-channel high-definition video algorithm acceleration and large matrix operations
- Total Block RAM Capacity: 34290 Kb, used for image frame caching, deep FIFO data buffering, waveform storage and algorithm parameter lookup tables
- Distributed RAM Capacity: 8440 Kb
3. النظام الفرعي لإدارة الساعة
- 12 وحدة إدارة التوقيت من نوع MMCM
- 12 حلقة تثبيت الطور (PLL)
Supports multi-clock domain generation, phase adjustment, clock delay compensation and high-frequency jitter suppression, satisfying strict timing synchronization requirements of ultra-large complex embedded systems
4. أجهزة الإرسال والاستقبال التسلسلية عالية السرعة
- 20 جهاز إرسال واستقبال تفاضلي عالي السرعة من طراز GTX
Maximum line rate up to 10.3125 Gbps, compatible with PCIe Gen2, 10 Gigabit Ethernet, CPRI, JESD204B, Aurora mainstream serial communication protocols
5. واجهات الإدخال/الإخراج ووحدة المراقبة المدمجة في الرقاقة
- Configurable user I/O pins: 560
I/O bank voltage adjustable from 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
Integrated dual-channel 12-bit XADC analog monitor to realize real-time continuous monitoring of die junction temperature, internal power supply voltages and external analog input signals
مواصفات مصدر الطاقة
Nominal core operating voltage: 1.0V
Logic fabric, Block RAM, DSP array and serial transceivers adopt independent isolated power domains separately
Typical overall power consumption: 13W ~ 38W; active forced-air cooling is required for stable continuous full-load operation under high-temperature limit conditions
متطلبات التغليف وتجميع المكونات الإلكترونية (SMT)
- Package Type: 1156-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be completed within 72 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered and stored in anti-static trays to prevent electrostatic damage during automated PCB mass production
القدرة على التكيف مع البيئة والموثوقية
The chip maintains stable long-term operation under wide temperature fluctuation, mechanical vibration, shock and moderate electromagnetic interference harsh industrial environments. It supports 256-bit AES bitstream encryption and SEU single-event upset detection and correction, featuring excellent thermal robustness and anti-interference performance for field rugged devices.
سيناريوهات التطبيق النموذجية
- High-end portable spectrum analyzers, multi-channel high-speed oscilloscopes and transient signal recording instruments
- Software-defined radio baseband processing platforms, outdoor small cell wireless communication main control equipment
- Multi-channel industrial machine vision inspection systems, high-speed real-time image processing units
- Industrial high-performance convergence gateways, multi-protocol fieldbus integration equipment
- Lightweight airborne radar signal preprocessing modules, vehicle-mounted multi-sensor fusion computing hosts
- Extended-temperature industrial high-performance SOM core boards and ultra-complex embedded algorithm prototype verification platforms
