| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K420T-2FFG901E | Kintex-7 | 32.575,00 | -2,00 | 416,960 | 30781440 | 380 | 0,97 – 1,03 V (típico: 1,0 V) | Montaje en superficie | 0 °C — 100 °C | 901-FCBGA | 901-FCBGA |
XC7K420T-2FFG901E
Fabricante: Xilinx
Células lógicas: 419,840
Rebanadas lógicas: 65,600
RAM integrada (eRAM): 30 240 Kb (840 × 36 Kb de RAM en bloque)
E/S máxima por usuario: 400
Paquete: FFG901 (BGA con chip invertido)
Grado de velocidad: -2
Temperatura de funcionamiento: Ampliado (0 °C a +100 °C)
Especificaciones
Explicación del número de pieza
This is an extended industrial temperature high-density FPGA from Xilinx Kintex-7 family, manufactured with mature 28nm process technology. It features abundant logic, DSP and memory resources with moderate packaging size, designed for rugged industrial control, communication baseband, portable test instruments and vehicular embedded systems that demand wide-temperature stable operation and balanced volume and performance.
- XC7K420T: High-density flagship model of Kintex-7 series; suffix T stands for low-power optimized silicon version
- -2: Speed Grade 2, universal balanced timing grade. It reserves sufficient timing margin for most large-scale high-frequency digital designs, achieving a perfect balance between maximum operating frequency, timing stability and total power consumption
- FFG901: 901-ball flip-chip FCBGA compact package. Smaller outline realizes equipment miniaturization while retaining enough I/O resources for multi-peripheral expansion
- E: Grado de temperatura industrial ampliada, rango de temperatura de unión de funcionamiento: -40 °C a +100 °C
Parámetros de los recursos de hardware integrados en el chip
1. Recursos generales sobre lógica programable
- Total Logic Cells: 424000
- Configurable Slices: 66250
- Total Flip-Flops: 530000
- Total LUT Lookup Tables: 265000
2. Recursos aritméticos y de memoria integrada
- DSP48E1 arithmetic slices: 1620 units, applied for large-scale FFT calculation, digital filtering, radar signal processing, multi-channel video algorithm acceleration and large matrix computation tasks
- Total Block RAM Capacity: 29880 Kb, used for image frame buffering, deep FIFO cache, waveform storage and algorithm parameter lookup tables
- Distributed RAM Capacity: 7360 Kb
3. Sistema de gestión del tiempo
- 10 MMCM clock management tiles
- 10 PLL phase locked loops
It supports multi-clock domain generation, phase fine adjustment, clock delay compensation and high-frequency jitter suppression, meeting strict synchronous timing requirements of complex large-scale digital systems
4. Transceptores seriales de alta velocidad
- 16 GTX high-speed differential transceivers
Velocidad máxima de línea de hasta 10,3125 Gbps, compatible con los protocolos de comunicación en serie más comunes: PCIe Gen2, 10 Gigabit Ethernet, CPRI, JESD204B y Aurora
5. Interfaces de E/S y módulo de monitoreo integrado en el chip
- Available user configurable I/O pins: 440
Voltaje del banco de E/S ajustable de 1,2 V a 3,3 V, totalmente compatible con LVCMOS, LVDS, HSTL, SSTL y todos los estándares de señal diferencial más comunes
Dual-channel 12-bit XADC analog monitor is integrated onboard, which continuously monitors die junction temperature, all internal power supply voltages and external analog input signals in real time
Especificaciones de la fuente de alimentación
Nominal core internal supply voltage: 1.0V
Independent isolated power domains are assigned to logic fabric, Block RAM, DSP array and high-speed transceivers respectively
Typical overall power consumption: 12W ~ 35W; compact active cooling module can guarantee stable full-load operation under upper temperature limit
Requisitos de empaque y ensamblaje SMT
- Package Type: 901-pin flip-chip FCBGA ball grid array
- Nivel de sensibilidad a la humedad: MSL4; todos los procesos de soldadura por reflujo deben completarse en un plazo de 72 horas después de abrir el empaque al vacío
- Lead-free design, fully compliant with RoHS environmental protection standards
- Packed and transported in anti-static trays to prevent electrostatic damage during automated PCB mass production
Adaptabilidad ambiental y confiabilidad
The chip can run continuously and stably under drastic temperature variation, mechanical vibration, impact and moderate electromagnetic interference harsh environments. It supports 256-bit AES bitstream encryption protection and SEU single-event upset detection and correction, with excellent thermal stability and anti-interference capability suitable for long-term field deployment.
Escenarios típicos de aplicación
- Portable high-end spectrum analyzers, multi-channel high-speed oscilloscopes and signal recording equipment
- Software-defined radio baseband platforms, outdoor small cell wireless communication control units
- Multi-channel industrial machine vision inspection main control boards, high-speed image processing terminals
- Vehicular multi-sensor fusion computing hosts, automotive intelligent edge computing devices
- Lightweight airborne radar signal preprocessing, flight data acquisition and forwarding modules
- Wide-temperature industrial high-performance SOM core boards and complex embedded algorithm verification platforms
