| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K420T-2FFG901E | Kintex-7 | 32.575,00 | -2,00 | 416,960 | 30781440 | 380 | 0,97 - 1,03 V (tip 1,0 V) | Yüzey montajı | 0 °C - 100 °C | 901-FCBGA | 901-FCBGA |
XC7K420T-2FFG901E
Üretici firma: Xilinx
Mantık Hücreleri: 419,840
Mantık Dilimleri: 65,600
Gömülü RAM (eRAM): 30.240 Kb (840 × 36Kb Blok RAM)
Maksimum Kullanıcı I/O: 400
Paket: FFG901 (Flip-Chip BGA)
Hız derecesi: -2
Çalışma Sıcaklığı: Genişletilmiş (0°C ila +100°C)
Teknik Özellikler
Part Number Explanation
This is an extended industrial temperature high-density FPGA from Xilinx Kintex-7 family, manufactured with mature 28nm process technology. It features abundant logic, DSP and memory resources with moderate packaging size, designed for rugged industrial control, communication baseband, portable test instruments and vehicular embedded systems that demand wide-temperature stable operation and balanced volume and performance.
- XC7K420T: High-density flagship model of Kintex-7 series; suffix T stands for low-power optimized silicon version
- -2: Speed Grade 2, universal balanced timing grade. It reserves sufficient timing margin for most large-scale high-frequency digital designs, achieving a perfect balance between maximum operating frequency, timing stability and total power consumption
- FFG901: 901-ball flip-chip FCBGA compact package. Smaller outline realizes equipment miniaturization while retaining enough I/O resources for multi-peripheral expansion
- E: Extended industrial temperature grade, operating junction temperature range: -40°C ~ +100°C
On-Chip Hardware Resource Parameters
1. General Programmable Logic Resources
- Total Logic Cells: 424000
- Configurable Slices: 66250
- Total Flip-Flops: 530000
- Total LUT Lookup Tables: 265000
2. Arithmetic & Embedded Memory Resources
- DSP48E1 arithmetic slices: 1620 units, applied for large-scale FFT calculation, digital filtering, radar signal processing, multi-channel video algorithm acceleration and large matrix computation tasks
- Total Block RAM Capacity: 29880 Kb, used for image frame buffering, deep FIFO cache, waveform storage and algorithm parameter lookup tables
- Distributed RAM Capacity: 7360 Kb
3. Clock Management System
- 10 MMCM clock management tiles
- 10 PLL phase locked loops
It supports multi-clock domain generation, phase fine adjustment, clock delay compensation and high-frequency jitter suppression, meeting strict synchronous timing requirements of complex large-scale digital systems
4. High-Speed Serial Transceivers
- 16 GTX high-speed differential transceivers
Maximum line rate up to 10.3125 Gbps, compatible with PCIe Gen2, 10 Gigabit Ethernet, CPRI, JESD204B, Aurora mainstream serial communication protocols
5. I/O Interfaces & On-Chip Monitoring Module
- Available user configurable I/O pins: 440
I/O bank voltage adjustable from 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
Dual-channel 12-bit XADC analog monitor is integrated onboard, which continuously monitors die junction temperature, all internal power supply voltages and external analog input signals in real time
Power Supply Specifications
Nominal core internal supply voltage: 1.0V
Independent isolated power domains are assigned to logic fabric, Block RAM, DSP array and high-speed transceivers respectively
Typical overall power consumption: 12W ~ 35W; compact active cooling module can guarantee stable full-load operation under upper temperature limit
Packaging & SMT Assembly Requirements
- Package Type: 901-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be completed within 72 hours after vacuum packaging is opened
- Lead-free design, fully compliant with RoHS environmental protection standards
- Packed and transported in anti-static trays to prevent electrostatic damage during automated PCB mass production
Environmental Adaptability & Reliability
The chip can run continuously and stably under drastic temperature variation, mechanical vibration, impact and moderate electromagnetic interference harsh environments. It supports 256-bit AES bitstream encryption protection and SEU single-event upset detection and correction, with excellent thermal stability and anti-interference capability suitable for long-term field deployment.
Tipik Uygulama Senaryoları
- Portable high-end spectrum analyzers, multi-channel high-speed oscilloscopes and signal recording equipment
- Software-defined radio baseband platforms, outdoor small cell wireless communication control units
- Multi-channel industrial machine vision inspection main control boards, high-speed image processing terminals
- Vehicular multi-sensor fusion computing hosts, automotive intelligent edge computing devices
- Lightweight airborne radar signal preprocessing, flight data acquisition and forwarding modules
- Wide-temperature industrial high-performance SOM core boards and complex embedded algorithm verification platforms
