XC5VFX70T-2FF1136I

Fabricante: Xilinx
Células lógicas: 71,680
Rebanadas lógicas: ~5,600
RAM integrada (eRAM): 5,456 Kb
Paquete: FF1136 (Fine?Pitch BGA)
Temperatura de funcionamiento: Industrial (-40°C a +100°C)

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    Especificaciones

    MODELO P/NSERIENÚMERO DE LABORATORIOS/CLBSGRADO DE VELOCIDADNÚMERO DE ELEMENTOS LÓGICOS / CELDASTOTAL BITS RAMNÚMERO DE E/STENSIÓN - ALIMENTACIÓNTIPO DE MONTAJETEMPERATURA DE FUNCIONAMIENTOPAQUETE / ESTUCHEPAQUETE DEL DISPOSITIVO DEL PROVEEDOR
    XC5VFX70T-2FF1136IVirtex-5 FXT5.600,00-2,007168054558726400,95 V-1,05 VMontaje en superficie-40 °C ~ +100 °C1136-FBGA / FCBGA1136-FCBGA (≈31×31 mm)

    XC5VFX70T-2FF1136I – Xilinx Virtex-5 FXT FPGA

    En XC5VFX70T-2FF1136I is a mid-density FPGA from the Xilinx Virtex-5 FXT family, intended for systems that combine embedded processing, high-speed serial interfaces, and reliable logic performance in a single device. At LXB Semicon, this part is typically supplied for industrial and communications projects where platform stability and long-term support are key design requirements.

    Logic Resources and Embedded Processing

    The XC5VFX70T provides approximately 70K logic cells, offering sufficient capacity for protocol handling, multi-interface control logic, and custom hardware acceleration. As part of the FXT family, it integrates dual PowerPC® 440 processors, allowing designers to implement system control, management software, and real-time tasks directly inside the FPGA fabric.

    En -2 grado de velocidad supports higher internal operating frequencies and tighter timing margins, making it suitable for designs with moderate to demanding performance requirements.

    High-Speed Serial Interfaces

    This device integrates Transceptores RocketIO™ GTX, enabling direct implementation of high-speed serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and proprietary point-to-point links. By integrating the serial interfaces on-chip, designers can reduce external components and simplify high-speed PCB design.

    On-Chip Memory and System Integration

    Integrated Bloque RAM resources support on-chip buffering, data queues, and local memory for the embedded processors. This reduces reliance on external memory, improves latency control, and helps maintain deterministic behavior in real-time systems.

    The Virtex-5 FXT platform is supported by a mature Xilinx development environment and a broad ecosystem of proven IP cores, which remains valuable for long-life products and maintenance-oriented programs.

    Package and Industrial Temperature Grade

    En 1136-ball flip-chip BGA package provides a high pin count for flexible I/O assignment and interface-dense board designs.
    En industrial temperature grade (I) ensures reliable operation across extended temperature ranges, making this device suitable for factory automation, outdoor communication equipment, and other demanding environments.

    Aplicaciones típicas

    The XC5VFX70T-2FF1136I is commonly used in:

    • Telecommunications and networking equipment

    • Embedded processing platforms with hardware–software co-design

    • Industrial control and automation systems

    • High-speed data acquisition and interface cards

    • Long-term production and legacy system support

    Although the Virtex-5 family is a mature generation, the XC5VFX70T remains a practical choice due to its balanced logic capacity, integrated CPU architecture, and proven field reliability. For engineers extending existing FXT-based designs or maintaining established platforms, it offers predictable performance with minimal redesign risk.