| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX70T-2FF1136I | Virtex-5 FXT | 5.600,00 | -2,00 | 71680 | 5455872 | 640 | 0.95V-1.05V | 표면 실장 | -40°C ~ +100°C | 1136-FBGA/FCBGA | 1136-FCBGA(≈31×31mm) |
XC5VFX70T-2FF1136I – Xilinx Virtex-5 FXT FPGA
그리고 XC5VFX70T-2FF1136I 의 중간 밀도 FPGA입니다. 자일링스 버텍스-5 FXT 제품군, intended for systems that combine embedded processing, high-speed serial interfaces, and reliable logic performance in a single device. At LXB 세미콘, this part is typically supplied for industrial and communications projects where platform stability and long-term support are key design requirements.
로직 리소스 및 임베디드 처리
XC5VFX70T는 대략 다음과 같은 기능을 제공합니다. 70만 개의 로직 셀, offering sufficient capacity for protocol handling, multi-interface control logic, and custom hardware acceleration. As part of the FXT family, it integrates 듀얼 PowerPC® 440 프로세서, allowing designers to implement system control, management software, and real-time tasks directly inside the FPGA fabric.
그리고 속도 등급 -2 supports higher internal operating frequencies and tighter timing margins, making it suitable for designs with moderate to demanding performance requirements.
High-Speed Serial Interfaces
This device integrates RocketIO™ GTX 트랜시버, enabling direct implementation of high-speed serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and proprietary point-to-point links. By integrating the serial interfaces on-chip, designers can reduce external components and simplify high-speed PCB design.
온칩 메모리 및 시스템 통합
통합 블록 RAM resources support on-chip buffering, data queues, and local memory for the embedded processors. This reduces reliance on external memory, improves latency control, and helps maintain deterministic behavior in real-time systems.
The Virtex-5 FXT platform is supported by a mature Xilinx development environment and a broad ecosystem of proven IP cores, which remains valuable for long-life products and maintenance-oriented programs.
Package and Industrial Temperature Grade
그리고 1136-ball flip-chip BGA package provides a high pin count for flexible I/O assignment and interface-dense board designs.
그리고 산업용 온도 등급(I) ensures reliable operation across extended temperature ranges, making this device suitable for factory automation, outdoor communication equipment, and other demanding environments.
일반적인 애플리케이션
The XC5VFX70T-2FF1136I is commonly used in:
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통신 및 네트워킹 장비
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하드웨어와 소프트웨어가 공동 설계된 임베디드 프로세싱 플랫폼
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Industrial control and automation systems
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고속 데이터 수집 및 인터페이스 카드
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Long-term production and legacy system support
Although the Virtex-5 family is a mature generation, the XC5VFX70T remains a practical choice due to its 균형 잡힌 로직 용량, 통합 CPU 아키텍처, 검증된 현장 신뢰성. For engineers extending existing FXT-based designs or maintaining established platforms, it offers predictable performance with minimal redesign risk.
