Especificaciones
MT48LC16M16A2P‑6A is a standard single-data-rate (SDR) SDRAM manufactured by Micron Technology, compliant with JEDEC SDRAM specifications for embedded industrial, FPGA, and legacy MCU buffer applications.
Desglose de sufijos
- MT48LC: Micron SDR SDRAM product series
- 16M16: Memory organization = 16M × 16-bit wide data bus
- A2P: Die revision & 54-pin TSOP-II pinout variant
- 6A: Speed grade with 6ns minimum clock cycle (167 MHz max frequency, CL=3 CAS latency)
- Two temperature variants:
- MT48LC16M16A2P‑6A:G – Commercial grade (0°C ~ +70°C), tray packaging
- MT48LC16M16A2P‑6A IT:G – Industrial grade (-40°C ~ +85°C), tape-and-reel optional
MT48LC16M16A2P-6A TSOP-II
1. Core Memory Architecture
Density & Internal Bank Layout
- Total capacity: 256Mb = 32MB physical storage
- Organization: 16,777,216 words × 16-bit data width
- 4 independent internal memory banks for interleaved read/write scheduling
- 1-bit prefetch SDR architecture, single data transfer per clock cycle
- Configurable burst lengths: 1, 2, 4, 8, full-page sequential burst modes
Timing & Speed Specifications
- Maximum clock frequency: 167 MHz, tCK = 6 ns
- CAS Latency: CL3 default, CL2 optional via mode register setup
- Data access time: 5.4 ns maximum
- Refresh scheme: 8192 auto-refresh cycles within a 64ms retention window
- Supports auto-precharge per bank and per-bank independent activate/precharge commands
2. Electrical Interface Parameters
- Operating supply voltage VDD/VDDQ: 3.0 V ~ 3.6 V (nominal 3.3 V LVTTL I/O signaling)
- All address, data, and control pins feature LVTTL-compatible input/output buffers
- No on-die termination (ODT); external series resistors required for PCB signal matching
- Separate byte-wide DQM data mask pins for independent high/low 8-bit write masking on the 16-bit bus
- Differential single-ended clock CK input, no complementary CK# pair
Power Consumption Modes
- Active operating current: Typical 100–125 mA under continuous read/write
- Precharge standby current: ~30 mA
- Self-refresh low-power mode: Sub-1 mA retention current for battery-backed idle systems
- Power-down mode for maximum static current reduction when memory is unused
3. Reliability & Compliance Features
- MSL 3 moisture sensitivity level (168-hour floor life after package opening before reflow soldering)
- Fully RoHS lead-free and REACH SVHC compliant green construction
- High latch-up and ESD protection for industrial control PCB environments
- Mode register programmable latency, burst length, and driver strength to optimize EMI performance
- Built-in power-fail safe refresh logic to prevent data loss during voltage fluctuations
4. Package Information
- Package type: 54-pin TSOP-II thin surface-mount package
- Physical dimension: 22.22 mm × 10.16 mm × 1.2 mm ultra-thin form factor
- Pin pitch: 0.8 mm standard SMT pitch for compact embedded board layouts
- Standard tray bulk shipment; tape-and-reel packaging (suffix -TR) available for mass automated SMT assembly
Aplicaciones típicas
- Legacy embedded MCU, ARM, and dsPIC real-time data buffer memory
- FPGA configuration buffer, industrial PLC, servo drive and motion control systems
- Portable handheld test & measurement instruments, audio DSP signal buffering
- Digital signage, POS payment terminal main working memory
- Medical diagnostic equipment low-speed data acquisition storage
- Retro consumer electronics, MIDI musical devices and embedded Linux single-board computers
- Factory automation distributed IO modules and rugged transportation monitoring hardware
LXB Semicon supplies original Micron MT48LC16M16A2P‑6A commercial/industrial grade 32MB x16 SDR SDRAM memory IC
