DS28EL15Q+T

DS28EL15 is a DeepCover secure authentication IC with SHA-256 cryptographic algorithm developed by Analog Devices (Maxim Integrated). Q stands for 6-lead thermally enhanced TDFN small surface mount package. The suffix +T represents lead-free tape-and-reel packaging designed for automated high-volume SMT mass production.

This secure authenticator chip adopts DeepCover multi-layer physical anti-tampering security architecture to protect confidential keys and stored data against physical probing attacks. It implements bidirectional challenge-response authentication based on standard SHA-256 hash algorithm compliant with FIPS 180-3 specification, supporting mutual verification between main host hardware and peripheral accessory modules to prevent counterfeit component access.

A total 512 bits of user-writable nonvolatile EEPROM is integrated for storing calibration parameters, configuration data and asset information. Independent protected secure memory space is reserved to store encryption private keys and memory access permission settings, which cannot be arbitrarily read or rewritten without authorized authentication. Every single chip is pre-programmed with an exclusive 64-bit factory ROM serial number, which acts as unique hardware ID for cryptographic calculation and device traceability.

Communication is realized via single-contact 1-Wire serial bus. Multiple chips can be connected on one shared bus line, and each device is addressed separately through its unique ROM ID. The operating supply voltage ranges from 1.71 V to 1.89 V, featuring ultra-low static power consumption suitable for battery-powered portable devices. Built-in comprehensive memory access permission management mechanisms flexibly configure read-only, write-protected and password-locked storage areas according to system security demands. Bidirectional authentication mode avoids unauthorized firmware tampering and illegal peripheral replacement effectively.

Encapsulated in compact 6-pin exposed pad TDFN plastic package with tiny outline footprint, which occupies minimal PCB layout space for miniature electronic modules. The bottom exposed pad optimizes thermal conduction and enhances electrical grounding stability. Moisture Sensitivity Level is MSL1, there is no time limitation for reflow soldering after the original vacuum packaging is opened. Continuous tape reel feeding fully matches automatic pick-and-place equipment workflow for large-scale electronic assembly production.

Industrial operating temperature range covers -40 °C to +85 °C, enabling stable long-term continuous operation inside consumer electronic products, medical devices, industrial automation equipment and automotive accessory systems under variable temperature environments. Manufactured with lead-free raw materials and production processes, the component complies with global RoHS environmental directives. Highly integrated single-chip security design eliminates discrete encryption circuits, simplifies anti-counterfeit hardware layout and shortens product security function development cycles.

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