| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX130T-1FFG1738I | Virtex-5 FXT | 10.240,00 | -1,00 | 131072 | 10985472 | 840 | 0,95 V-1,05 V | Oberflächenmontage | -40 °C ~ +100 °C | 1738-FBGA, FCBGA | 1738-FCPBGA (42,5×42,5 mm) |
XC5VFX130T-1FFG1738I – Xilinx Virtex-5 FXT FPGA
Die XC5VFX130T-1FFG1738I is a high-capacity FPGA from the Xilinx Virtex-5 FXT family, built for systems that combine embedded processing, high-speed serial interfaces, and large logic resources. At LXB Halbleiter, this device is typically supplied for industrial and communication platforms where long-term availability and predictable performance are critical.
Logic Resources and Embedded Processing
With approximately 130K logic cells, the XC5VFX130T provides ample headroom for complex datapaths, multi-channel processing, and hardware acceleration. The FXT architecture integrates dual PowerPC® 440 processors, enabling designers to run real-time control, system management, and protocol stacks directly inside the FPGA without relying on an external CPU.
Die -1 Geschwindigkeitsstufe offers stable and well-characterized timing performance, making this part suitable for designs that prioritize reliability and deterministic behavior over maximum clock frequency.
High-Speed Serial Connectivity
This device includes RocketIO™ GTX-Transceiver, allowing direct implementation of high-speed serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and custom point-to-point links. For many systems, this level of integration reduces board complexity and improves signal integrity.
Memory and System Integration
A substantial amount of on-chip Block RAM supports buffering, packet queues, and local storage for embedded processors. This reduces external memory traffic and helps maintain consistent latency in real-time systems.
Virtex-5 FXT devices are supported by a mature Xilinx toolchain and a wide ecosystem of existing IP cores, which is especially valuable for maintenance programs and platform reuse.
Package and Industrial Temperature Rating
Die FFG1738 flip-chip BGA package provides a very high pin count, enabling flexible I/O planning and support for interface-dense designs.
Die industrial temperature grade (I) ensures reliable operation across extended temperature ranges, making the XC5VFX130T suitable for factory automation, outdoor communication equipment, and other demanding environments.
Engineering Value Today
Although Virtex-5 is a mature FPGA family, the XC5VFX130T remains a practical choice due to its integrated CPU architecture, proven field reliability, and stable development environment. It is often selected for system upgrades, replacements, and continued production where redesign risk must be minimized.
