XC4VSX35-10FFG668C

Hersteller: AMD / Xilinx
Logische Zellen: 34,560
Logische Schnitte: 3,840
Eingebettetes RAM (eRAM): 3.456.000 Bits
Paket: FFG668 (27×27 mm)
Betriebstemperatur: 0°C bis +85°C (kommerziell)

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    Spezifikationen

    MODELL P/NSERIEANZAHL DER LABORE/KLINIKENGESCHWINDIGKEITSSTUFEANZAHL DER LOGIKELEMENTE / ZELLENRAM-BITS INSGESAMTANZAHL DER E/ASPANNUNG - VERSORGUNGBEFESTIGUNGSTYPBETRIEBSTEMPERATURVERPACKUNG / KASSELIEFERANT GERÄTEPAKET
    XC4VSX35-10FFG668CVirtex-4 SX3.840,000,0034560 Logische Elemente3.538.944 Bits4481,14 V ~ 1,26 VOberflächenmontageHandelsüblich (0°C ~ +85°C)668-BBGA, FCBGA668-FCBGA (27×27)

    XC4VSX35-10FFG668C: Virtex-4 SX Optimized for Digital Signal Processing

    Die XC4VSX35-10FFG668C remains a cornerstone for high-performance DSP applications within the Xilinx Virtex-4 family. Specifically engineered for signal processing-intensive workloads, the SX sub-family provides a significantly higher ratio of DSP48 slices compared to the LX or FX variants.

    Technical Breakdown & Core Specifications

    The “SX” designation is the critical factor here. While the LX focuses on logic density, the SX35 is built for arithmetic heavy-lifting.

    • Logische Zellen: 34,560

    • DSP48 Slices: 192 (The primary advantage for filter design and FFTs)

    • Block RAM: 3,456 Kb

    • Maximale Benutzer-E/A: 448

    • Paket: FFG668 (Fine-pitch Flip-Chip BGA, Lead-Free/RoHS compliant)

    • Geschwindigkeitsstufe: -10

    • Temperature Grade: Commercial (0°C to 85°C)

    Why Sourcing This Part Matters Now

    In the current market, the XC4VSX35-10FFG668C is often utilized in Form, Fit, and Function (FFF) replacements for aging defense and telecommunications hardware. We understand that for these applications, “New/Clean” date codes and verifiable CoC (Certificate of Conformance) documentation are more important than price.

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