XC4VSX35-10FFG668C

Manufacturer: AMD / Xilinx
Logic Cells: 34,560
Logic Slices: 3,840
Embedded RAM (eRAM): 3,456,000 bits
Package: FFG668 (27×27 mm)
Operating Temperature: 0°C to +85°C (Commercial)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC4VSX35-10FFG668CVirtex-4 SX3.840,000,0034560 Logic Elements3,538,944 bits4481.14 V ~ 1.26 VSurface MountCommercial (0°C ~ +85°C)668‑BBGA, FCBGA668‑FCBGA (27×27)

    XC4VSX35-10FFG668C: Virtex-4 SX Optimized for Digital Signal Processing

    The XC4VSX35-10FFG668C remains a cornerstone for high-performance DSP applications within the Xilinx Virtex-4 family. Specifically engineered for signal processing-intensive workloads, the SX sub-family provides a significantly higher ratio of DSP48 slices compared to the LX or FX variants.

    Technical Breakdown & Core Specifications

    The “SX” designation is the critical factor here. While the LX focuses on logic density, the SX35 is built for arithmetic heavy-lifting.

    • Logic Cells: 34,560

    • DSP48 Slices: 192 (The primary advantage for filter design and FFTs)

    • Block RAM: 3,456 Kb

    • Maximum User I/O: 448

    • Package: FFG668 (Fine-pitch Flip-Chip BGA, Lead-Free/RoHS compliant)

    • Speed Grade: -10

    • Temperature Grade: Commercial (0°C to 85°C)

    Why Sourcing This Part Matters Now

    In the current market, the XC4VSX35-10FFG668C is often utilized in Form, Fit, and Function (FFF) replacements for aging defense and telecommunications hardware. We understand that for these applications, “New/Clean” date codes and verifiable CoC (Certificate of Conformance) documentation are more important than price.

    📩 Contact LXB Semicon for availability, pricing, and technical support.