XC4VLX200-11FFG1513C

Nhà sản xuất: Xilinx
Tế bào logic: 178,176?(~200K system gates)
Các lát cắt logic: 22,272
Bộ nhớ RAM tích hợp (eRAM): 6,193 Kb (~336 × 18Kb Block RAM)
Gói: FFG1513 (BGA chip lật)
Nhiệt độ hoạt động: Thương mại (0°C đến +85°C)

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    Thông số kỹ thuật

    MÃ SẢN PHẨMBỘ PHIMSỐ LƯỢNG PHÒNG THÍ NGHIỆM/CLBSĐỘ BỀN THEO TỐC ĐỘSỐ LƯỢNG PHẦN TỬ LỐI / TẾ BÀOTổng số bit RAMSỐ LƯỢNG I/OĐiện áp – Nguồn cấpLoại lắp đặtNHIỆT ĐỘ HOẠT ĐỘNGGÓI / HỘPGÓI THIẾT BỊ CỦA NHÀ CUNG CẤP
    XC4VLX200-11FFG1513CVirtex-4 LX22.272,00-11,0020044861931529601,14 V ~ 1,26 VLắp đặt bề mặt0 °C ~ +85 °C (Commercial)1513-BBGA (FCBGA)1513-FCBGA

    XC4VLX200-11FFG1513C: The Performance Pinnacle of High-Density Logic Integration

    The XC4VLX200-11FFG1513C is the highest-specification, high-density FPGA in the Xilinx Virtex®-4 LX family. Built on the 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device is engineered for architects who require the absolute maximum logic capacity paired with the superior -11 speed grade. It is the industry-standard choice for complex, logic-heavy applications where timing closure and single-chip integration are critical.

    Featuring a staggering 200,448 Logic Cells and the fastest commercial speed grade, the LX200-11 is designed to push the boundaries of real-time data processing and large-scale system emulation.

    Key Engineering Advantages

    • Fastest Timing Closure (-11 Speed Grade): The -11 speed grade is essential for high-performance designs, providing a significant frequency boost over the standard -10 models. This extra headroom is vital for stabilizing 300MHz+ internal logic fabrics and high-speed memory interfaces.

    • Massive Logic Consolidation: With over 200k logic cells, this FPGA allows for the integration of entire multi-processor systems, complex encryption engines, and massive state machines into a single die, eliminating the latency and complexity of multi-chip partitioning.

    • Unrivaled I/O Capacity: Housed in the FFG1513 package, the device provides 960 User I/Os. This allows for massive parallel throughput, easily supporting multiple wide-bus interfaces like DDR2/QDR-II and high-speed backplane protocols.

    • High-Performance DSP & Memory: Includes 6,048 Kb of Block RAM96 XtremeDSP™ slices. The combination of dense memory and dedicated arithmetic hardware makes it a powerhouse for real-time signal processing and 4K video algorithms.

    • RoHS Compliant Flip-Chip Packaging: The FFG1513 package is optimized for both environmental compliance and thermal integrity. Its design ensures low-inductance power delivery and superior heat dissipation, even at high switching frequencies.


    Technical Specification Matrix

    Tính năngThông số kỹ thuật
    Tế bào logic200,448
    CLB Array22,512
    Total Block RAM6,048 Kb
    DSP48 Slices96
    Max User I/O960
    Đánh giá tốc độ-11 (High Performance)
    Temperature GradeThương mại (0°C đến +85°C)
    GóiFFG1513 (Lead-Free / 1.0mm Pitch)

    Why Specify the LX200-11C?

    1. Solving the Routing Congestion Challenge

    In many high-density designs, routing congestion can kill timing. The Virtex-4 ASMBL architecture in the LX200 ensures a highly uniform distribution of logic, memory, and I/O. Combined with the -11 speed grade, this allows for much easier timing closure on designs that utilize 85% or more of the available logic resources.

    2. Signal Integrity at Scale

    Driving nearly 1,000 I/Os simultaneously requires a robust power distribution network. The FFG1513 package is specifically designed with an extensive array of VCC and GND pins to suppress Simultaneous Switching Noise (SSN), ensuring clean signal eyes for high-speed differential and single-ended signaling.

    3. Long-Lifecycle Stability

    The LX200-11C is a proven, mature platform. For mission-critical commercial systems—such as high-end medical scanners or broadcasting switchers—the stability of the Virtex-4 toolchain and the known reliability of the 90nm process provide a low-risk path to production.


    Ứng dụng mục tiêu

    • ASIC/SoC Prototyping: Large-scale logic verification and pre-silicon emulation.

    • Professional Video Gear: Real-time 8K/4K image reconstruction and conversion.

    • Telecommunications: High-bandwidth switching fabrics and protocol acceleration.

    • Advanced Instrumentation: High-speed data acquisition and real-time analysis for scientific research.