XC4VLX100-11FFG1148I

Nhà sản xuất: Xilinx
Tế bào logic: 110,592
Các lát cắt logic: 49,152
Bộ nhớ RAM tích hợp (eRAM): 4,320 Kb (240 × 18Kb Block RAM)
Gói: FFG1148 (Flip?Chip BGA)
Nhiệt độ hoạt động: Công nghiệp (-40°C đến +100°C)

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    Thông số kỹ thuật

    MÃ SẢN PHẨMBỘ PHIMSỐ LƯỢNG PHÒNG THÍ NGHIỆM/CLBSĐỘ BỀN THEO TỐC ĐỘSỐ LƯỢNG PHẦN TỬ LỐI / TẾ BÀOTổng số bit RAMSỐ LƯỢNG I/OĐiện áp – Nguồn cấpLoại lắp đặtNHIỆT ĐỘ HOẠT ĐỘNGGÓI / HỘPGÓI THIẾT BỊ CỦA NHÀ CUNG CẤP
    XC4VLX100-11FFG1148IVirtex-4 LX11.520,00-11,009984044789767681,14 V ~ 1,26 VLắp đặt bề mặt-40 °C ~ +100 °C (Công nghiệp)1148-BBGA (FCBGA)1148-FCBGA

    XC4VLX100-11FFG1148I: The High-Speed Industrial Benchmark for Large-Scale Logic

    The XC4VLX100-11FFG1148I is a high-performance, industrial-grade FPGA designed for mission-critical systems that demand both massive logic density and uncompromising timing precision. Built on Xilinx’s proven 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device offers 110,592 Logic Cells binned for the premium -11 speed grade.

    Engineered for Industrial-grade (-40°C to +100°C) operation, this FPGA is the definitive choice for architects who need to maintain 300MHz+ internal clock frequencies in environments where thermal fluctuations and long-term reliability are non-negotiable.

    Core Engineering Highlights

    • Peak -11 Speed Grade: The -11 grade provides significantly faster switching and reduced propagation delays compared to standard models. This extra timing headroom is critical for complex, high-utilization RTL designs where setup-and-hold closure is often the primary bottleneck.

    • Industrial Temperature Resilience: Rated for -40°C to +100°C junction temperature. This ensures that timing models remain valid even in high-heat industrial enclosures or unconditioned outdoor telecommunications cabinets.

    • High-Bandwidth I/O Management: The FFG1148 package breaks out 768 User I/Os. Supporting Xilinx’s SelectIO™ technology, it facilitates clean, high-speed interfacing with multiple DDR2/QDR-II memory banks and high-width parallel system buses.

    • Integrated XtremeDSP™ Blocks: Equipped with 96 DSP48 slices. These dedicated hardware multipliers and accumulators allow for intensive arithmetic operations (up to 400MHz+) without taxing the general-purpose logic fabric—essential for real-time filtering and sensor fusion.

    • High-Density Memory Hierarchy: Tính năng 4,320 Kb of Block RAM (BRAM), providing the low-latency buffering and deep FIFO structures required for high-throughput stream processing and localized data caching.


    Technical Specification Matrix

    Tính năngThông số kỹ thuật
    Tế bào logic110,592
    Configurable Logic Blocks (CLBs)12,480
    Total Block RAM4,320 Kb
    DSP48 Slices96
    Maximum User I/O768
    Đánh giá tốc độ-11 (Premium High-Performance)
    Temperature GradeCông nghiệp (-40°C đến +100°C)
    GóiFFG1148 (Lead-Free Flip-Chip BGA)

    Why Specify the LX100-11I?

    1. Predictable Reliability in Saturated Designs

    When logic utilization pushes past 80%, routing congestion usually kills timing. The combination of the ASMBL architecture and the -11 speed grade mitigates this “congestion penalty,” ensuring that your critical paths meet their frequency targets even when the chip is nearly full.

    2. Superior Signal Integrity

    The FFG1148 Flip-Chip package is designed to minimize parasitic inductance. The dense grid of power and ground pins helps suppress Simultaneous Switching Noise (SSN), providing the clean signal integrity required for robust, high-speed differential and single-ended signaling.

    3. Long-Lifecycle Product Stability

    The Virtex-4 series is a cornerstone of high-reliability industries. For projects requiring a 10-15 year service life—such as power grid monitoring, aerospace ground equipment, or medical imaging backplanes—the LX100-11I offers a proven track record and a well-documented toolchain.


    Ứng dụng

    • Industrial Automation: High-precision robotics, motion control hubs, and multi-axis synchronizers.

    • Telecommunications: Outdoor base station signal processing and protocol conversion.

    • Defense & Aerospace: Ground support systems and secure communication bridges.

    • Medical Systems: Real-time data acquisition and reconstruction backends for CT/MRI scanners.