XCKU3P-2SFVB784I

Manufacturer: AMD / Xilinx
Logic Cells: 1,326,480
Logic Slices: 20,900+
Embedded RAM (eRAM): 75,000+ Kb
Package: SFVB784 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C TJ)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XCKU3P-2SFVB784IKintex® UltraScale+20,34-2,00355,950 LE316416003040.825 V ~ 0.876 VSurface Mount−40 °C ~ +100 °C (I grade)784-FCBGA784-FCBGA