XC7Z100-1FFG900I

Manufacturer: AMD / Xilinx
Logic Cells: 444,000
Logic Slices: 69,850
Embedded RAM (eRAM): 26,000+ Kb
Package: FFG900 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C TJ)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7Z100-1FFG900IZynq-700026.150,00-1,00277,400262000002501.0 VSurface MountIndustrial (−40 °C ~ 100 °C)BGA-900900-FCBGA (31×31 mm)